Electronic device including antenna

ABSTRACT

An electronic device in accordance with an example embodiment of the disclosure includes a first non-conductive cover defining a first surface of the electronic device, a second non-conductive cover including a first portion defining a second surface of the electronic device, and a second portion defining one portion of a lateral surface of the electronic device, a conductive frame defining an other portion of the lateral surface of the electronic device, and an antenna module, wherein the antenna module is positioned so that the one surface is substantially perpendicular to the second surface at a position within a specified proximity to the lateral surface of the electronic device and is configured to transmit and/or receive a signal through the lateral surface.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based on and claims priority under 35 U.S.C. § 119to Korean Patent Application No. 10-2019-0019557, filed on Feb. 19, 2019in the Korean Intellectual Property Office, and Korean PatentApplication No. 10-2019-0096379, filed on Aug. 7, 2019, in the KoreanIntellectual Property Office, the disclosures of which are incorporatedby reference herein their entireties.

BACKGROUND 1. Field

The disclosure relates to an electronic device including an antenna fora wireless communication.

2. Description of Related Art

An electronic device such as a smart phone, a tablet PC may performwireless communication. Recently, an electronic device capable ofperforming 5G communication using millimeter-wave (hereinafter,“mmWave”) has been released. The term “mmWave” may refer to anultra-high frequency of approximately 6 GHz to 300 GHz. The electronicdevice may include a plurality of antenna modules therein, and maytransmit and receive a mmWave signal in various directions.

An electronic device transmits and receives an RF signal using a metalhousing exposed to an outside or a metal radiator disposed therein, orusing a metal radiator containing polycarbonate (PC). Alternatively, theelectronic device transmits and receives an RF signal using a radiatorof a metal pattern plated on a surface of a PC radiator. In theelectronic device, a communication circuit or modem connected to anantenna radiator may be mounted on a printed circuit board and may beseparately from the antenna radiator.

When the electronic device supports communication protocols (e.g., afrequency of 6 GHz or smaller) lower than or including a 4Gcommunication protocol, the electronic device performs wirelesscommunication using a radiator made of metal materials inside andoutside the electronic device.

When the electronic device supports a 5G communication protocol, theelectronic device uses a high frequency band width (e.g., a wavelengthof about 6 GHz to 100 GHz). Thus, the electronic device has an antennamodule mounted therein including a combination of a plurality of dipoleantennas and a patch antenna to perform wireless communication. Theelectronic device may not be able to efficiently transmit and receive a5G signal in various directions depending on a mounting position of theantenna module, a fixed structure thereof at the mounting position, anarrangement of components around the mounting position, an externalelement, a distance from the external element, and the like.

The above information is presented as background information only toassist with an understanding of the disclosure. No determination hasbeen made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the disclosure.

SUMMARY

Embodiments of the disclosure provide an electronic device having anantenna. According to an example embodiment, an electronic device mayinclude a display, a housing having a first surface through which thedisplay is viewable, a second surface opposite the first surface,lateral surfaces between the first surface and the second surface, afirst antenna module including at least one antenna disposed inside thehousing adjacent to a first lateral surface of the lateral surfaces, anda second antenna module including at least one antenna disposed insidethe housing adjacent to a second lateral surface of the lateralsurfaces. The housing may include a first plate covering the firstsurface a second plate covering the second surface, and a conductivestructure comprising a conductive material disposed between the firstsurface and the second surface and at least partially exposed to theoutside through the lateral surfaces. A height of a portion of thesecond plate extending along the first lateral surface may be less thana height of a portion of the second plate extending along the secondlateral surface.

According to an example embodiment, an electronic device may include afirst non-conductive cover defining at least a portion of a firstsurface of the electronic device, a second non-conductive coverincluding a first portion defining at least a portion of a secondsurface of the electronic device opposite the first surface, and asecond portion extending from an edge of the first portion and definingone portion of a lateral surface of the electronic device between thefirst surface and the second surface, a conductive frame defining another portion of the lateral surface of the electronic device, and anantenna module including one surface defining a radiator, wherein theantenna module is positioned so that the one surface is substantiallyperpendicular to the second surface at a position within a specifiedproximity to the lateral surface of the electronic device and isconfigured to transmit and/or receive a signal through the lateralsurface, wherein the second non-conductive cover comprises glass,wherein at least a half of the one surface of the antenna module isdirected toward the second portion of the second non-conductive cover.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the present disclosure will be more apparent from thefollowing detailed description taken, in conjunction with theaccompanying drawings, in which:

FIG. 1 is a diagram illustrating an appearance of an example electronicdevice according to various embodiments;

FIG. 2 is a diagram illustrating example placement of a first antennamodule on a first lateral surface according to various embodiments;

FIG. 3 is a diagram illustrating an example placement mode of a firstantenna module according to various embodiments;

FIG. 4 is a cross-sectional view illustrating a region adjacent to afirst antenna module according to various embodiments.

FIG. 5 is a diagram illustrating example placement tilt change of afirst antenna module according to various embodiments;

FIG. 6 is a diagram illustrating example placement of a second antennamodule on a second lateral surface according to various embodiments;

FIG. 7 is a diagram illustrating an example placement mode of a secondantenna module according to various embodiments;

FIG. 8 is a cross-sectional view illustrating a region adjacent to asecond antenna module according to various embodiments;

FIG. 9 is a diagram illustrating example placement tilt change of asecond antenna module according to various embodiments;

FIG. 10 is a diagram illustrating a height of a curved portion of asecond plate at each lateral surface according to various embodiments;

FIG. 11 is a diagram illustrating example mounting of a side key of anelectronic device according to various embodiments;

FIG. 12 is a diagram illustrating example mounting of a light-emissionelement associated with an antenna operation according to variousembodiments;

FIG. 13 is a diagram illustrating an example light-emission elementaccording to various embodiments;

FIG. 14 is a cross-sectional view illustrating an example electronicdevice having a light-emission element mounted thereon according tovarious embodiments;

FIG. 15 is a diagram illustrating example structures of first, secondand third antenna modules according to various embodiments;

FIG. 16 is a cross-sectional view illustrating the first to thirdantenna modules of FIG. 15 according to various embodiments;

FIG. 17 is a diagram illustrating an example electronic device accordingto various embodiments;

FIG. 18 is a diagram illustrating example placements of a first antennamodule and a third antenna module on a third lateral surface accordingto various embodiments;

FIG. 19 is a diagram illustrating an example placement mode of a firstantenna module according to various embodiments;

FIG. 20 is a cross-sectional view illustrating a region adjacent to afirst antenna module according to various embodiments;

FIG. 21 is a diagram illustrating example placement tilt change of asecond antenna module according to various embodiments;

FIG. 22 is a diagram illustrating formation of an example radiatingspace in a radiating surface of a second antenna module according tovarious embodiments; and

FIG. 23 is a block diagram illustrating an example electronic device ina network environment according to various embodiments.

DETAILED DESCRIPTION

Hereinafter, various example embodiments of the disclosure are describedwith reference to the accompanying drawings. However, it should beunderstood that the various example embodiments are not intended tolimit techniques described in the disclosure to specific embodiments andthe disclosure includes various modifications, equivalents, and/oralternatives of the embodiments of the disclosure. In connection withthe description of the drawings, similar reference numerals may be usedfor similar components.

FIG. 1 is a diagram illustrating an example appearance of an exampleelectronic device according to various embodiments.

Referring to FIG. 1, an electronic device 101 may include a display 110and a housing 120.

The display 110 may display various contents such as a text or an image.The display 110 may be exposed or viewable through a first surface 121of the housing 120. The display 110 may occupy most of the first surface121 of the housing 120. The display 110 may have a structure in which aplurality of layers including a display panel and a touch panel arestacked.

The housing 120 may include the first surface 121, a second surface 122,a first lateral surface 123, a second lateral surface 124, a thirdlateral surface 125, and a fourth lateral surface 126.

The first surface 121 may be a surface through which the display 110 isexposed or viewable. Most of the first surface 121 may include an activeregion of the display 110.

According to various embodiments, the first surface 121 may beimplemented as one plate 210 (see, e.g., FIG. 2, hereinafter, a firstplate) (or a first glass panel or a first non-conductive cover). Thefirst plate 210 may include a non-conductive material (e.g. glass orplastic). For example, the first plate 210 may be a glass panel or aglass cover that covers a display panel.

According to various embodiments, the first plate 210 may be planaralong and on the first surface 121, and may at least partially extend tothe first lateral surface 123, the second lateral surface 124, the thirdlateral surface 125, or the fourth lateral surface 126. The portion ofthe first plate 210 extending to the first lateral surface 123, thesecond lateral surface 124, the third lateral surface 125 or the fourthlateral surface 126 may have a curved surface shape with a specifiedcurvature.

According to various embodiments, the first plate may include a hole 121a provided in at least a portion thereof accommodating a sensor or afront camera.

According to various embodiments, the second surface 122 may be asurface opposite to the first surface 121. The second surface 122 may bea surface through which the display 110 is not exposed or viewable.

According to various embodiments, the second surface 122 may beimplemented as one plate 230 (see, e.g., FIG. 2 hereinafter, a secondplate) (or a second glass panel or a second non-conductive cover). Thesecond plate 230 may include a non-conductive material (e.g. glass orplastic). The second plate 230 may include the same material as thefirst plate 210.

The second plate 230 may be planar along and on the second surface 122.At least a portion thereof may extend to the first lateral surface 123,the second lateral surface 124, the third lateral surface 125, or thefourth lateral surface 126. The portion extending to the first lateralsurface 123, the second lateral surface 124, the third lateral surface125 or the fourth lateral surface 126 may have a curved surface shapewith a specified curvature.

According to various embodiments, the second plate 230 may include ahole 122 a provided in at least a portion thereof accommodating a sensoror a rear camera.

The first lateral surface 123 (e.g., a top surface), the second lateralsurface 124 (e.g., a left lateral surface), the third lateral surface125 (e.g., a right lateral surface) or the fourth lateral surface 126(e.g., a bottom surface) may include at least a portion of a curvedportion of the first plate, a curved portion of the second plate or aconductive structure (or a conductive frame) (e.g., a metal housing).

According to an example embodiment, a surface area occupied by thecurved portion of the first plate, a surface area occupied by the curvedportion of the second plate, or a surface area occupied by theconductive structure may vary based on the first lateral surface 123(e.g., a top surface), the second lateral surface 124 (e.g., a leftlateral surface), the third lateral surface 125 (e.g., a right lateralsurface), or the fourth lateral surface 126 (e.g., a bottom surface).

For example, the first lateral surface 123 (e.g., a top surface) may besubstantially occupied by the curved portion of the second plate and theconductive structure. The fourth lateral surface 126 opposed to thefirst lateral surface 123 may be substantially occupied by theconductive structure.

In another example, each of the second lateral surface 124 and the thirdlateral surface 125 may include all of the curved portion of the firstplate, the curved portion of the second plate, and the conductivestructure having different heights (or surface areas).

According to various embodiments, the housing 120 may include variouscomponents necessary for driving the electronic device 101 therein. Forexample, the housing 120 may include a main substrate 180 therein. Themain substrate 180 may have various components such as a processor, amemory, and a wireless communication circuit mounted inside the housing120. According to an embodiment, the wireless communication circuit maytransmit and receive a signal having a frequency between about 6 GHz and100 GHz. Further, the housing 120 may include various components such asa battery, a sensor, a camera module, a speaker or a connector therein.

According to various embodiments, the electronic device 101 may includea plurality of antenna modules 130, 140, and 150 inside the housing 120.Each antenna module may transmit and receive a signal of a specifiedfrequency band.

According to various embodiments, the plurality of antenna modules 130,140, and 150 may transmit and receive a signal of a millimeter-wave ormmWave according to the 5G communication protocol. The millimeter wavemay be an ultra-high frequency of about 6 to 300 GHz. The millimeterwave may increase transmission/reception efficiency using a beamformingtechnique of multiple antennas. The plurality of antenna modules 130,140, and 150 may transmit millimeter waves in a specified direction viabeamforming technology. The plurality of antenna modules 130, 140, and150 may be disposed in the housing 120 in various forms to smoothlytransmit and receive the RF signal in six directions of the electronicdevice 101.

According to an example embodiment, the plurality of antenna modules130, 140, and 150 may include the first antenna module 130, the secondantenna module 140, and the third antenna module 150.

The first antenna module 130 may be disposed adjacent to the firstlateral surface 123. The first antenna module 130 may include twodifferent types of antennas (e.g., a patch antenna and a dipoleantenna). The first antenna module 130 may radiate a signal to the firstsurface 121, the second surface 122, or the first lateral surface 123 ofthe electronic device 101.

The second antenna module 140 may be disposed adjacent to a top of thesecond lateral surface 124. In an example embodiment, the second antennamodule 140 may include one type of an antenna (e.g., a patch antenna).The second antenna module 140 may radiate a signal to the first surface121, the second surface 122, or the second lateral surface 124 of theelectronic device 101. In another embodiment, the second antenna module140 may include a first type antenna and a second type antenna. Forexample, the first type antenna may be a patch antenna disposed so thata first radiating surface is directed toward the second lateral surface124. The second type antenna may be a dipole antenna disposed so that asecond radiating surface is directed toward the first lateral surface123.

The third antenna module 150 may be disposed adjacent to a bottom of thethird lateral surface 125. In an example embodiment, the third antennamodule 150 may include one type of an antenna (e.g., a patch antenna).The third antenna module 150 may radiate the signal to the first surface121, the second surface 122, or the third lateral surface 125 of theelectronic device 101. In another embodiment, the third antenna module150 may include a first type antenna and a second type antenna. Forexample, the first type antenna may be a patch antenna disposed so thata first radiating surface is directed toward the third lateral surface125. The second type antenna may be a dipole antenna positioned so thata second radiating surface is directed toward the fourth lateral surface126.

FIG. 2 is a diagram illustrating example placement of the first antennamodule on the first lateral surface according to various embodiments.

Referring to FIG. 2, the first lateral surface (the first lateralsurface (123) of FIG. 1) may include a curved portion 230 a of thesecond plate 230 and a conductive structure (or a conductive frame) 220.Across the first lateral surface 123, the curved portion of the firstplate 210 may occupy a relatively small portion as compared to thecurved portion 230 a and the conductive structure 220 of the secondplate 230 may occupy. The curved portion of the first plate 210 may beabsent along and on the first lateral surface 123.

For example, in a portion of the first lateral surface 123 adjacent tothe first antenna module 130, a height (or a thickness) H_11 of thecurved portion 230 a of the second plate 230 may be less than or equalto a height (or a thickness) H_12 of the conductive structure 220.

According to various embodiments, the conductive structure 220 mayinclude an opening into which a tray 250 may be inserted.

According to various embodiments, the first antenna module 130 may bedisposed adjacent to the first lateral surface 123. The first antennamodule 130 may include two different types of antennas (e.g., a patchantenna and a dipole antenna).

According to various embodiments, the first antenna module 130 may bedisposed inside the electronic device 101 and may be closer to thesecond plate 230 than to the first plate 210. The first antenna module130 may radiate the mmWave signal through the second plate 230 or thecurved portion 230 a of the second plate 230.

FIG. 3 is a diagram illustrating an example placement mode of the firstantenna module according to various embodiments. FIG. 3 is an exampleand the disclosure is not limited thereto.

Referring to FIG. 3, in a region adjacent to the first lateral surface123, the electronic device 101 may include the conductive structure 220,a contact 225, the first antenna module 130, a guide 310, a flexibleprinted circuit board 320, a connector 330, and the main substrate 180.

The conductive structure 220 may form a portion of a lateral surface ofthe housing 120. The conductive structure 220 may act as an antennaradiator for transmitting and receiving a signal having a specifiedfrequency band. For example, the conductive structure 220 may act as anantenna radiator for the 4G communication (e.g., a signal of 6 GHz orlower).

The contact 225 may be electrically connected with the conductivestructure 220. The contact 225 may be in contact with a feed point or aground point of the conductive structure 220 and may be electricallyconnected to the main substrate 180 inside the housing 120. For example,the contact 225 may transmit an RF signal for the 4G communication.

According to various embodiments, the first antenna module 130 mayinclude a first type antenna 131 and a second type antenna 132.

The first type antenna 131 may be a patch antenna disposed so that afirst radiating surface (or a patch surface) 131 a is directed towardthe second plate 230. The first type antenna 131 may radiate the mmWavesignal through the second plate 230.

The second type antenna 132 may be a dipole antenna disposed so that asecond radiating surface 132 a is directed toward the first lateralsurface 123. The second type antenna 132 may radiate the mmWave signalthrough the second plate 230 or the curved portion 230 a of the secondplate 230.

The guide 310 may guide a placement position of the first antenna module130. The flexible printed circuit board 320 may be connected to one endof the first antenna module 130. The flexible printed circuit board 320may transmit a signal which the first antenna module 130 transmits andreceives. The connector 330 may electrically connect the flexibleprinted circuit board 320 and the main substrate 180 with each other.

On the main substrate 180, elements such as a communication circuit, aprocessor or a memory may be mounted such that the elements may beelectrically connected to each other via the main substrate 180. Themain substrate 180 may be electrically connected to the first antennamodule 130 via the flexible printed circuit board 320 and the connector330.

FIG. 4 is a cross-sectional view illustrating an example region adjacentto the first antenna module according to various embodiments. FIG. 4 maybe a cross-sectional view taken across a line A-A′ in FIG. 1. FIG. 4 isillustrative and the disclosure is not limited thereto.

Referring to FIG. 4, in a region adjacent to the first antenna module130, the electronic device 101 may include the first plate 210, theconductive structure 220, the contact 225, the second plate 230, thefirst antenna module 130, the main substrate 180, and an adhesive member350.

The first plate 210 may include a non-conductive material (e.g., glassor plastic). The first plate 210 may not extend to the first lateralsurface 123.

The conductive structure 220 may form a portion of the first lateralsurface 123 of the housing 120. The conductive structure 220 may act asan antenna radiator for 4G communication. The conductive structure 220may include an opening into which the tray 250 may be inserted. The tray250 may hold a SIM card or a memory card therein.

The second plate 230 may include a non-conductive material (e.g. glassor plastic). The second plate 230 may form a planar portion 230 n alongand on the second surface 122 of the housing 120. The second plate 230may at least partially extend to the first lateral surface 123 to definethe curved portion 230 a. The curved portion 230 a may have a curvedsurface shape having a specified curvature.

In the first lateral surface 123 of the housing 120, the conductivestructure 220 may abut the curved portion 230 a of the second plate 230.The conductive structure 220 and the curved portion 230 a of the secondplate 230 may occupy most of the first lateral surface 123. For example,in a portion of the first lateral surface 123 adjacent to first antennamodule 130, a height (or a thickness) H_11 of the curved portion 230 aof the second plate 230 may be less than or equal to a height (or athickness) H_12 of the conductive structure 220. On the other hand, thefirst plate 210 may not extend to the first lateral surface 123 or mayhave a smaller height than those of the curved portion 230 a of thesecond plate 230 and the conductive structure 220.

The contact 225 may be electrically connected with the conductivestructure 220. The contact 225 may be in contact with a feed point or aground point of the conductive structure 220 and may be electricallyconnected to the main substrate 180 inside the housing 120. The contact225 may transfer an RF signal for 4G communication.

The first antenna module 130 may have the first radiating surface 131 a.The first radiating surface 131 a may be a surface from which the firsttype antenna (e.g., a patch antenna) 131 radiates an mmWave signal. Aradiating space (or an air gap) 130 a may be defined between the firstradiating surface 131 a of the first antenna module 130 and the secondplate 230.

The first type antenna (e.g., a patch antenna) 131 may radiate an mmWavesignal through the radiating space (or an air gap) 130 a.

On the main substrate 180, the first antenna module 130 may be mounted.The main substrate 180 may be electrically connected to a communicationcircuit and a processor.

The adhesive member 350 may be disposed between the first antenna module130 and the main substrate 180. The adhesive member 350 may fix thefirst antenna module 130 to the main substrate 180.

FIG. 5 is a diagram illustrating example placement tilt change of thefirst antenna module according to various embodiments.

Referring to FIG. 5, in a first placement mode 501, the first antennamodule 130 may have the first radiating surface 131 a parallel to theplanar portion 230 n of the second plate 230. The first radiatingsurface 131 a may be a surface from which the first type antenna (e.g.,a patch antenna) 131 emits the mmWave signal. A rectangular radiatingspace (or an air gap) 510 may be defined between the first radiatingsurface 131 a of the first antenna module 130 and the second plate 230.The first type antenna (e.g., a patch antenna 131) may radiate themmWave signal through the radiating space (or an air gap) 510.

In a second placement mode 502 or third placement mode 503, the firstantenna module 130 may have an inclined first radiating surface 131 athat is not parallel to the planar portion 230 n of the second plate230. The first radiating surface 131 a may be a surface from which thefirst type antenna (e.g., a patch antenna) 131 emits the mmWave signal.A triangular radiating space (or an air gap) 520 or 530 may be definedbetween the first radiating surface 131 a of the first antenna module130 and the second plate 230. The first type antenna (e.g., a patchantenna 131) may radiate the mmWave signal through the radiating spaces(or air gaps) 520 and 530.

In the second placement mode 502, the first radiating surface 131 a maybe tilted toward a center of the planar portion 230 n of the secondplate 230 to improve radiating performance in a direction toward theplanar portion 230 n of the second plate 230. The second radiatingsurface 132 a may be directed toward a location between the planarportion 230 n and the curved portion 230 a of the second plate 230.

In the third placement mode 503, to improve radiating performance in adirection toward the display 110, the first radiating surface 131 a maybe tilted to be directed toward a location between the planar portion230 n and the curved portion 230 a of the second plate 230. The secondradiating surface 132 a may be directed toward the conductive structure220 or connector 250.

FIG. 6 is a diagram illustrating example placement of the second antennamodule on the second lateral surface according to various embodiments.

Referring to FIG. 6, the second lateral surface (e.g., a left lateralsurface) (the second lateral surface 124 of FIG. 1) may include all of acurved portion 230 b of the second plate 230, the conductive structure220 and a curved portion 210 b of the first plate 210. For example, in aportion of the second lateral surface 124 adjacent to the second antennamodule 140, the curved portion 230 b of the second plate 230 may have aheight (or a thickness) H_21, the conductive structure 220 may have aheight or a thickness H_22, and the curved portion 210 b of the firstplate 210 may have a height (or a thickness) H_23. According to anexample embodiment, in the portion of the second lateral surface 124adjacent to the second antenna module 140, H_21>H_22 and H_21>H_23, butthe disclosure is not limited thereto.

According to various embodiments, the second antenna module 140 may bedisposed adjacent to the second lateral surface 124. The second antennamodule 140 may include one type of antenna (e.g., a patch antenna).

According to various embodiments, the second antenna module 140 may bedisposed inside the electronic device 101 and may be closer to thesecond plate 230 than to the first plate 210. The second antenna module140 may radiate the mmWave signal through the curved portion 230 b ofthe second plate 230.

FIG. 7 is a diagram illustrating an example placement mode of the secondantenna module according to various embodiments. FIG. 7 is illustrativeand the disclosure is not limited thereto.

Referring to FIG. 7, in a region adjacent to the second lateral surface124, the electronic device 101 may include the second antenna module140, the conductive structure 220, a radiating member (e.g., the PCpart) 705, a fixing member 710, a flexible printed circuit board 720, aconnector 730, and the main substrate 180.

The second antenna module 140 may include a first type antenna. Thefirst type antenna may be a patch antenna disposed such that a firstradiating surface 141 a is directed toward the radiating member (ornon-conductive member) (e.g., the polycarbonate (PC) part) 705. Thefirst type antenna may radiate the mmWave signal through the radiatingmember (e.g., the PC part 705).

The conductive structure 220 may form a portion of the lateral surfaceof the housing 120. The conductive structure 220 may act as an antennaradiator for 4G communication.

The radiating member (e.g., the PC part) 705 may be disposed in contactwith an inner surface of the curved portion 230 b of the second plate230. A radiating space (or an air gap) may be defined between theradiating member (e.g., the PC part) 705 and the first radiating surface141 a of the second antenna module 140.

The radiating member (e.g., the PC part) 705 may include a first portion705 a and a second portion 705 b. The first portion 705 a may have ashape parallel to the first radiating surface 141 a. The first portion705 a may be in contact with the inner surface of the curved portion 230b of the second plate 230. The second portion 705 b may be disposedbetween the first portion 705 a and the first radiating surface 141 a.The second portion 705 b may extend in a perpendicular manner to thefirst portion 705 a and may include a plurality of the second portions.A radiating space (or an air gap) may be defined between the secondportion 705 b and the first radiating surface 141 a.

The flexible printed circuit board 720 may be connected to one end ofthe second antenna module 140. The flexible printed circuit board 720may transmit a signal which the second antenna module 140 transmits andreceives. The connector 730 may electrically connect the flexibleprinted circuit board 720 and the main substrate 180 with each other.

The components such as a communication circuit, a processor or a memorymay be mounted on the main substrate 180 and may be electricallyconnected to each other via the main substrate 180. The main substrate180 may be electrically connected to the second antenna module 140 viathe flexible printed circuit board 720 and the connector 730.

FIG. 8 is a cross-sectional view illustrating an example region adjacentto the second antenna module according to various embodiments. FIG. 8may be a cross-sectional view of a B-B′ direction in FIG. 1. FIG. 8 isillustrative and the disclosure is not limited thereto.

Referring to FIG. 8, in the region adjacent to the second antenna module140, the electronic device 101 may include the second antenna module140, the main substrate 180, the first plate 210, the conductivestructure 220, the second plate 230, the radiating member (e.g., the PCpart) 705, and the fixing member 710.

The second antenna module 140 may have the first radiating surface 141a. The first radiating surface 141 a may be a surface from which thefirst type antenna (e.g., a patch antenna) radiates the mmWave signal. Aradiating space (or an air gap) 140 a may be defined by the firstradiating surface 141 a of the second antenna module 140, the secondplate 230 and the radiating member (e.g., the PC part) 705. The firsttype antenna (e.g., a patch antenna) may radiate the mmWave signalthrough radiating space (or an air gap) 140 a.

The main substrate 180 may electrically connect the second antennamodule 140 with a communication circuit and a processor.

The first plate 210 may include a non-conductive material (e.g., glassor plastic). The first plate 210 may include a planar portion 210 nalong and on the first surface 121 of the housing 120. The first plate210 may at least partially extend to the second lateral surface 124 todefine the curved portion 210 b. The curved portion 210 b of the firstplate 210 may have a curved surface shape having a specified curvature.

The conductive structure 220 may form a portion of the second lateralsurface 124 of the housing 120. In the region adjacent to the secondantenna module 140, a thickness of the conductive structure 220 on thesecond lateral surface 124 may be smaller than that on the first lateralsurface 123 (see, e.g., FIG. 3 and FIG. 4). The conductive structure 220may be connected to an inner bracket 220 a. According to variousembodiments, the conductive structure 220 and the inner bracket 220 amay include different metal materials. For example, the conductivestructure 220 may include stainless steel (SUS), while the inner bracket220 a may include aluminum (Al).

The second plate 230 may include a non-conductive material (e.g., glassor plastic). The second plate 230 may form the planar portion 230 nalong and on the second surface 122 of the housing 120. The second plate230 may at least partially extend to the second lateral surface 124 todefine the curved portion 230 b. The curved portion 230 b of the secondplate 230 may have a curved surface shape having a specified curvature.

In the second lateral surface 124, the conductive structure 220 mayabut, at one end, the curved portion 230 b of the second plate 230, andmay abut, at the other end, the curved portion 210 b of the first plate210. In the second lateral surface 124, the curved portion 230 b of thesecond plate 230 may be longer than the curved portion 210 b of thefirst plate 210. The conductive structure 220 may be disposed to becloser to the first plate 210 than to the second plate 230.

The second lateral surface 124 may include the curved portion 230 b ofthe second plate 230, the conductive structure 220, and the curvedportion 210 b of the first plate 210. For example, in the portion of thesecond lateral surface 124 adjacent to the second antenna module 140, aheight (or a thickness) H_21 of the curved portion 230 a of the secondplate 230 may be greater than a height (or a thickness) H_23 of thecurved portion 210 b of the first plate 210 or a height (or a thickness)H_22 of the conductive structure 220.

According to various embodiments, the fixing member 710 may be disposedadjacent to the second antenna module 140. The fixing member 710 may fixa shape of the second antenna module 140.

FIG. 9 is a diagram illustrating example placement tilt change of thesecond antenna module according to various embodiments.

Referring to FIG. 9, in a first placement mode 901, the second antennamodule 140 may have the first radiating surface 141 a perpendicular tothe planar portion 230 n of the second plate 230. The first radiatingsurface 141 a may be a surface from which the first type antenna (e.g.,a patch antenna) radiates the mmWave signal.

The second antenna module 140 may radiate the mmWave signal through theradiating member (e.g., the PC part) 705 and the curved portion 230 b ofthe second plate 230. The radiating space (or an air gap) 140 a may beformed between the radiating member 705 and the first radiating surface141 a of the second antenna module 140.

In a second placement mode 902 or third placement mode 903, the secondantenna module 140 may have a tilted first radiating surface 141 a thatis not perpendicular to the planar portion 230 n of the second plate230. The first radiating surface 141 a may be a surface from which thefirst type antenna (e.g., a patch antenna) radiates the mmWave signal. Ashape of the radiating member (e.g., the PC part 705) may vary in acorresponding manner to an inclination angle of the second antennamodule 140.

In the second placement mode 902, to improve radiating performance in adirection toward the display 110, the first radiating surface 141 a maybe tilted toward the conductive structure 220.

In the third placement 903, to improve radiating performance in adirection toward the planar portion 230 n of the second plate 230, thefirst radiating surface 141 a may be tilted to be directed toward alocation between the planar portion 230 n and the curved portion 230 aof the second plate 230.

According to various embodiments, features related to the second antennamodule 140 of FIGS. 6, 7, 8 and 9 may be equally or similarly applied tothe third antenna module 150 of FIG. 1.

FIG. 10 is a diagram illustrating a height of the curved portion of thesecond plate in each lateral surface according to various embodiments.FIG. 10 is illustrative and the disclosure is not limited thereto.

Referring to FIG. 10, the second plate 230 may include a non-conductivematerial (e.g. glass or plastic). The second plate 230 may include theplanar portion 230 n along and on the second surface 122 of the housing120. The second plate 230 may at least partially extend to the lateralsurface of the housing 120 to define curved portions 230 a, 230 b, 230 cand 230 d. Each of the curved portions 230 a, 230 b, 230 c, and 230 dmay have a curved surface shape having a specified curvature.

The second plate 230 may extend to the first lateral surface (the firstlateral surface 123 of FIG. 1) (e.g., a top surface) to define the firstcurved portion 230 a. The first curved portion 230 a may have the firstheight H_11.

The second plate 230 may extend to the second lateral surface (thesecond lateral surface 124 of FIG. 1) (e.g., a left lateral surface) todefine the second curved portion 230 b. The second curved portion 230 bmay have the second height H_21.

The second plate 230 may extend to the third lateral surface (the thirdlateral surface 125 of FIG. 1) (e.g., a right lateral surface) to definethe third curved portion 230 c. The third curved portion 230 c may havea third height H_31.

The second plate 230 may extend to the fourth lateral surface (thefourth lateral surface 126 of FIG. 1) (e.g., a left lateral surface) todefine the fourth curved portion 230 d. The fourth curved portion 230 dmay have a fourth height H_41. According to an example embodiment, whenthe second plate 230 does not extend to the fourth lateral surface 126,the fourth curved portion 230 d may be absent.

According to an example embodiment, the second height H_21 of at least aportion of the second curved portion 230 b may be equal to the thirdheight H_31 of at least a portion of the third curved portion 230 c. Forexample, in a portion where a physical button (e.g., a volume button, apower button) is not mounted, the second height H_21 of the secondcurved portion 230 b may be equal to the third height H_31 of the thirdcurved portion 230 c.

According to an embodiment, the first height H_11, the second heightH_21, the third height H_31, and the fourth height H_41 may, forexample, and without limitation, have a relationship: the second heightH_21=the third height H_31>the first height H_11.

According to another embodiment, the first height H_11, the secondheight H_21, the third height H_31, and the fourth height H_41 may, forexample, and without limitation, have a relationship: the second heightH_21=the third height H_31>the first height H_11=the fourth height H_41.According to still another embodiment, the first height H_11, the secondheight H_21, the third height H_31, and the fourth height H_41 may, forexample, and without limitation, have a relationship: the second heightH_21=the third height H_31>the first height H_11>the fourth height H_41.

According to various embodiments, the first height H_11, the secondheight H_21, the third height H_31, and the fourth height H_41 may bedetermined based on areas of the radiating surfaces of the antennamodules disposed adjacent to each other. In the first lateral surface123, the first antenna module 130 for mmWave communication may have aradiating surface parallel to the second surface. In the second lateralsurface 124 and third lateral surface 125, each of the second antennamodule 140 and third antenna module 150 for mmWave communication mayhave a radiating surface perpendicular to the second surface. The fourthlateral surface 126 may not include a separate first antenna module 130for mmWave communication. Accordingly, each of the second height H_21and third height H_31 may be greater than the first height H_11 orfourth height H_41. The first height H_11 may be greater than the fourthheight H_41.

FIG. 11 is a diagram illustrating example mounting of a side key of theelectronic device according to various embodiments.

Referring to FIG. 11, an electronic device 1101 may include a firstplate 1110, a conductive structure 1120, and a second plate 1130defining an outer surface thereof.

The first plate 1110 may form the first surface of the electronic device1101 (a surface on which a main display is mounted). The second plate1130 may form a second surface opposite to the first surface of theelectronic device 1101.

Along and on the lateral surface of the electronic device 1101, thefirst plate 1110 or second plate 1130 may at least partially extend in aform of a curved surface.

In the lateral surface of the electronic device 1101, the conductivestructure 1120 (or a metal housing) may be disposed between a curvedportion 1110 b of the first plate 1110 and a curved portion 1130 b ofthe second plate 1130.

According to various embodiments, the electronic device 1101 may includea side key 1150 exposed from the lateral surface to an outside. The sidekey 1150 may be a physical button exposed through the opening formed inthe conductive structure 1120.

At a portion of the conductive structure 1120 where the side key 1150 isdisposed, the conductive structure 1120 may include an extension 1121extending toward the second plate 1130. The extension 1121 may allow thecurved portion 1130 b of the second plate 1130 may to be relativelysmall in height (or a thickness).

For example, in a portion of the conductive structure 1120 where theside key 1150 is not disposed, the curved portion 1130 b of the secondplate 1130 may have a first height (or a thickness) H_51_0, and theconductive structure 1120 may have a second height (or a thickness)H_52_0. In a portion of the conductive structure 1120 where the side key1150 is disposed, the curved portion 1130 b of the second plate 1130 mayhave a third height (or a thickness) H_51 smaller than the first height(or a thickness) H_51_0, and the conductive structure 1120 may have afourth height (or a thickness) H_52 greater than the second height (or athickness) H_52_0.

In the cross-sectional view of I-I′, in a peripheral region in which theside key 1150 is disposed, the electronic device 1101 may include thefirst plate 1110, the conductive structure 1120, the second plate 1130,and the side key 1150.

The first plate 1110 may include a non-conductive material (e.g., glassor plastic). The first plate 1110 may include a planar portion 1110 nalong and on the first surface of the electronic device 1101 (a surfaceon which the main display is mounted). The first plate 1110 may at leastpartially extend to the lateral surface of the electronic device 1101 todefine the curved portion 1110 b. The curved portion 1110 b of the firstplate 1110 may have a curved surface shape having a specified curvature.

The conductive structure 1120 may form a portion of the lateral surfaceof the electronic device 1101. The conductive structure 1120 may includethe opening through which the side key 1150 is exposed.

The second plate 1130 may include a non-conductive material (e.g., glassor plastic). The second plate 1130 may form a planar portion 1130 nalong and on the second surface (a rear surface) of the electronicdevice 1101. The second plate 1130 may at least partially extend to thelateral surface of the electronic device 1101 to define the curvedportion 1130 b. The curved portion 1130 b of the second plate 1130 mayhave a curved surface shape having a specified curvature.

In a region of the conductive structure where the side key 1150 isdisposed, one end of the conductive structure 1120 may be in contactwith the curved portion 1130 b of the second plate 1130, while the otherend thereof may contact the curved portion 1110 b of the first plate1110. The curved portion 1130 b of the second plate 1130 may be longerthan the curved portion 1110 b of the first plate 1110.

The lateral surface of the electronic device 1101 in which the side key1150 is disposed may include the curved portion 1130 b of the secondplate 1130, the conductive structure 1120, and the curved portion 1110 bof the first plate 1110. For example, a height (or a thickness) H_51 ofthe curved portion 1130 b of the second plate 1130 may be greater than aheight (or a thickness) H_53 of the curved portion 1110 b of the firstplate 1110. A height (or a thickness) H_52 of the conductive structure1120 may be greater than the height (or a thickness) H_51 of the curvedportion 1130 b of the second plate 1130 or the height (or a thickness)H_53 of the curved portion 1110 b of the first plate 1110.

A height (or a thickness) H_55 of the first portion adjacent to thesecond plate 1130 of the conductive structure 1120 may be less than aheight (or a thickness) H_57 of the second portion adjacent to the firstplate 1110. A height (or a thickness) H_56 of the side key 1150 may begreater than the height (or a thickness) H_55 of the first portion.

According to various embodiments, the side key 1150 may include a firstmovable portion 1151, a second movable portion 1152, an elastic portion1153, and a button 1154.

The first movable portion 1151 may be a portion exposed to the outsidethrough an opening formed in the conductive structure 1120. The firstmovable portion 1151 may move inwardly of the electronic device 1101 byan external pressure.

The second movable portion 1152 may be disposed between the firstmovable portion 1151 and the elastic portion 1153. When the firstmovable portion 1151 is moved inwardly by the external pressure, thesecond movable portion 1152 may transmit a force due to the externalpressure to the elastic portion 1153.

The elastic portion 1153 may be disposed between the second movableportion 1152 and the button 1154. The elastic portion 1153 may have anelastic force, and may transmit the force transmitted by the secondmovable portion 1152 to the button 1154 to operate the button 1154.

The button 1154 may be actuated by the force transmitted from theelastic portion 1153. When the button 1154 is actuated by the forcetransmitted therefrom, the button 1154 may generate an associatedelectrical signal. The processor inside the electronic device 1101 mayexecute a related function in response to the electrical signal.

FIG. 12 is a diagram illustrating example mounting of a light-emissionelement associated with an antenna operation according to variousembodiments.

Referring to FIG. 12, an electronic device 1201 may include alight-emission element 1250 inside the housing. A rear plate 1230 of theelectronic device 1201 may include a transmissive portion 1240 thattransmits at least a portion of the light emitted from thelight-emission element 1250.

According to various embodiments, the light-emission element 1250 mayoperate in conjunction with an operation of the antenna module (e.g., ammWave antenna) inside the electronic device 1201. For example, thelight-emission element 1250 may be turned on when the antenna moduletransmits and receives the mmWave signal according to a 5G communicationprotocol. The light-emission element 1250 may be turned off when theantenna module transmits and receives an RF signal according a legacy 4Gcommunication protocol.

FIG. 13 is a diagram illustrating an example light-emission elementaccording to various embodiments.

Referring to FIG. 13, the light-emission element 1250 may include asubstrate 1251, a light-emitter (e.g., including a light emitting diode)1252, a flexible printed circuit board (or conductive wire) 1253, and aconnector 1254.

On the substrate 1251, the light-emitter (e.g., LED) 1252 may be mountedwhich may be electrically connected thereto. The light-emitter 1252 maygenerate light under a control signal of an internal processor of theelectronic device 1201. The flexible printed circuit board (or aconductive wire) 1253 may transmit a control signal related to theoperation of the light-emitter 1252. The connector 1254 may electricallyconnect the flexible printed circuit board 1253 to the main substrateinside the electronic device 1201.

FIG. 14 is a cross-sectional view illustrating an example electronicdevice having a light-emission element mounted thereon according tovarious embodiments.

Referring to FIG. 14, the light-emission element 1250 may be disposedbetween the rear plate 1230 and a shield can 1260 of the electronicdevice 1201. A waveguide for transmitting light may be formed betweenthe light-emission element 1250 and the plate 1230.

The shield can 1260 may block light or heat generated from thelight-emission element 1250 to prevent and/or reduce affecting thesurrounding elements.

FIG. 15 illustrates an example embodiment of structures of the first tothird antenna modules 130, 140, and 150 as described with reference toFIG. 1 in one example. 1500 a of FIG. 15 is a perspective view of thefirst to third antenna modules 130, 140, and 150 from one side. 1500 bof FIG. 15 is a perspective view of the first to third antenna modules130, 140, and 150 viewed from an opposite side. 1500 c in FIG. 15 is across-sectional view taken across a line A-A′ of the first to thirdantenna modules 130, 140 and 150.

Referring to FIG. 15, in an example embodiment, each of the first tothird antenna module 130, 140 and 150 may include a printed circuitboard 1510, an antenna array 1530, RFIC (a radio frequency integratedcircuit) 1552, PMIC (a power manage integrated circuit) 1554, and amodule interface (not shown). Optionally, each of the first to thirdantenna modules 130, 140, and 150 may further include a shielding member1590. In other embodiments, at least one of the mentioned components maybe omitted, or at least two of the components may be integrally formedwith each other.

The printed circuit board 1510 may include multiple of conductivelayers, and multiple of non-conductive layers alternately stacked withthe conductive layers. The printed circuit board 1510 may provideelectrical connections between the printed circuit board 1510 and/orvarious electronic parts disposed externally using wires and conductivevias formed in the conductive layers.

The antenna array 1530 may include a plurality of antenna elements 1532,1534, 1536, or 1538 arranged to define a directional beam. The antennaelements may be formed on a first surface of the printed circuit board1510 as shown. According to another embodiment, the antenna array 1530may be formed within the printed circuit board 1510. According toembodiments, the antenna array 1530 may include the plurality of antennaarrays (e.g., a dipole antenna array, and/or a patch antenna array) ofthe same or different shape or type.

RFIC 1552 may be disposed in another region (the second surface oppositeto the first surface) of the printed circuit board 1510 spaced apartfrom the antenna array 1530. The RFIC 1552 may be configured to processa signal of a selected frequency band as transmitted/received throughthe antenna array 1530. According to an embodiment, the RFIC 1552 mayconvert a baseband signal obtained from a communication processor (notshown) into an RF signal of a specified band in a transmitting process.The RFIC 1552, in a reception process, may convert the RF signalreceived through the antenna array 1530 into a baseband signal andtransmit the baseband signal to the communication processor.

According to another embodiment, in a transmitting process, the RFIC1552 may up-convert an IF signal (e.g., about 9 GHz to about 11 GHz)obtained from IFIC (an intermediate frequency integrated circuit) to anRF signal of a selected band. The RFIC 1552, in a reception process, maydown-convert the RF signal obtained through the antenna array 1530 intoan IF signal, and deliver the IF signal to the IFIC.

The PMIC 1554 may be disposed on another portion (e.g., the secondsurface) of the printed circuit board 1510 as spaced apart from theantenna array. The PMIC 1554 may be supplied with a voltage from a mainPCB (not shown) to provide power to various parts on the antenna module,for example, RFIC 1552.

The shielding member 1590 may be disposed on a portion (e.g., the secondsurface) of the printed circuit board 1510 to electromagnetically shieldat least one of RFIC 1552 or PMIC 1554. According to an embodiment, theshielding member 1590 may include a shield can.

Although not shown, in various embodiments, the first to third antennamodule 130, 140, and 150 may be electrically connected to anotherprinted circuit board (e.g., a main circuit substrate) via the moduleinterface. The module interface may include a connection member (e.g., acoaxial cable connector, a board to board connector, an interposer, or aflexible printed circuit board (FPCB)). Via the connection member, RFIC1552 and/or PMIC 1554 of the first to third antenna modules 130, 140,and 150 may be electrically connected to the printed circuit board.

FIG. 16 is a cross section taken across a line B-B″ of each of the firstto third antenna modules 130, 140 and 150 of 1500 a of FIG. 15. Theprinted circuit board 1510 of the illustrated embodiment may include anantenna layer 1611 and a network layer 1613.

The antenna layer 1611 may include at least one dielectric layer 1637-1,and an antenna element 1536 and/or electrical feed 1625 formed on anouter surface of the dielectric layer or therein. The electrical feed1625 may include an electrical feed point 1627 and/or an electrical feedline 1629.

The network layer 1613 includes at least one dielectric layer 1637-2,and at least one ground layer 1633, at least one conductive via 1635, atransmission line 1623, and/or a signal line 1629 formed on an outersurface of the dielectric layer or therein.

In addition, in the illustrated embodiment, RFIC 1552 of 1500 c of FIG.15 may be electrically connected to the network layer 1613 via, forexample, first and second connectors (solder bumps 1640-1, 1640-2). Inother embodiments, various connection structures such as soldering orBGA may be used instead of the connector. The RFIC 1552 may beelectrically connected to the antenna element 1536 via the firstconnector 1640-1, the transmission line 1623, and the electrical feed1625. RFIC 1552 may be electrically connected to the ground layer 1633via the second connector 1640-2, and the conductive via 1635. Althoughnot shown, RFIC 1552 may be electrically connected to theabove-mentioned module interface via the signal line 1629.

FIG. 17 is a diagram illustrating an example electronic device accordingto various embodiments.

Referring to FIG. 17, an electronic device 1701 may include a display1710 and a housing 1720.

The display 1710 may display various contents such as a text or animage. The display 1710 may be exposed through a first surface 1721 ofthe housing 1720. The display 1710 may occupy most of the first surface1721. The display 1710 may have a structure in which a plurality oflayers including a display panel and a touch panel are stacked.

The housing 1720 may include the first surface 1721, a second surface1722, a first lateral surface 1723, a second lateral surface 1724, athird lateral surface 1725, and a fourth lateral surface 1726.

The first surface 1721 may be a surface through which the display 1710is viewable. The most of the first surface 1721 may be defined as anactive region of display 1710.

According to various embodiments, the first surface 1721 may be embodiedas one plate 1810 (see, e.g., FIG. 18, hereinafter, a first plate 1810)(or a first glass panel). The first plate 1810 may include anon-conductive material (e.g. glass, plastic). For example, the firstplate 1810 may be a glass panel or glass cover that covers the displaypanel. According to an embodiment, the first plate 1810 may include aninorganic oxide (e.g., glass, ceramic, sapphire).

According to various embodiments, the first plate 1810 may be planaralong and on the first surface 1721 and may at least partially extend tothe second lateral surface 1724 or third lateral surface 1725. Theportion thereof extending to the second lateral surface 1724 or thirdlateral surface 1725 may have a curved surface shape with a specifiedcurvature.

According to various embodiments, the first plate 1810 may include ahole 1721 a defined in at least a portion thereof for exposing a sensoror a front camera to an outside.

According to various embodiments, the second surface 1722 may be asurface opposite to the first surface 1721. The second surface 1722 maybe a surface through which the display 1710 is not exposed.

According to various embodiments, the second surface 1722 may beimplemented as one plate 1830 (see, e.g., FIG. 18, hereinafter, a secondplate 1830) (or a second glass panel). The second plate 1830 may includea non-conductive material (e.g. glass or plastic). The second plate 1830may included the same material as the first plate 1810. The second plate1830 may include inorganic oxide (e.g. glass, ceramic, sapphire).

The second plate 1830 may be planar along and on the second surface 1722and may at least partially extend to the second lateral surface 1724 orthird lateral surface 1725. The portion thereof extending to the secondlateral surface 1724 or the third lateral surface 1725 may have a curvedsurface shape with a specified curvature.

According to various embodiments, the second plate 1830 may include ahole 1722 a defined at least a portion thereof for exposing a sensor ora rear camera.

The second lateral surface 1724 (e.g., a left lateral surface) or thethird lateral surface 1725 (e.g., a right lateral surface) may includeat least a portion of the curved portion of the first plate 1810, thecurved portion of the second plate 1830, or a conductive structure(e.g., a metal housing).

According to various embodiments, the housing 1720 may include variouscomponents necessary for driving the electronic device 1701 therein. Forexample, the housing 1720 may include a main substrate 1780 therein. Onthe main substrate 1780, a variety of components such as a processor,memory, and communication circuit, mounted inside the housing 1720 maybe mounted. Further, the housing 1720 may include various componentssuch as batteries, sensors, camera modules, speakers or connectorstherein.

According to various embodiments, the electronic device 1701 may includea plurality of antenna modules 1730, 1740, and 1750 in the housing 1720.Each antenna module may transmit and receive a signal of a specifiedfrequency band.

According to various embodiments, the plurality of antenna modules 1730,1740, and 1750 may transmit and receive a millimeter-wave or mmWavesignal according to 5G communication protocol. The millimeter wave maybe an ultra-high frequency of about 6 to 300 GHz. The millimeter wavemay increase transmission/reception efficiency using a beamformingtechnique of multiple antennas. The plurality of antenna modules 1730,1740 and 1750 may transmit a millimeter wave signal in a specifieddirection via beamforming technology. The plurality of antenna modules1730, 1740, and 1750 may be disposed in the housing 1720 in variousforms to smoothly transmit and receive an RF signal in six planedirections of the electronic device 1701.

According to an example embodiment, the plurality of antenna modules1730, 1740, and 1750 may include the first antenna module 1730, thesecond antenna module 1740, and the third antenna module 1750.

The first antenna module 1730 may be disposed adjacent to the firstlateral surface 1723. The first antenna module 1730 may include twodifferent types of antennas (e.g., a patch antenna and a dipoleantenna). The first antenna module 1730 may radiate a signal to thesecond surface 1722 or third lateral surface 1725 of the electronicdevice 1701.

The second antenna module 1740 may be disposed adjacent to the secondlateral surface 1724. For example, the second antenna module 1740 may bedisposed in a middle of the second lateral surface 1724 or in a regionadjacent a corner between the first lateral surface 1723 and the secondlateral surface 1724. In an example embodiment, the second antennamodule 1740 may include one type of antenna (e.g., a patch antenna). Thesecond antenna module 1740 may radiate the signal to the first surface1721, the second surface 1722, or the second lateral surface 1724 of theelectronic device 1701. In another embodiment, the second antenna module1740 may include a first type antenna and a second type antenna. Forexample, the first type antenna may be a patch antenna. The second typeantenna may be a dipole antenna.

The third antenna module 1750 may be disposed adjacent to the thirdlateral surface 1725. For example, the third antenna module 1750 may belocated in a middle of the third lateral surface 1725 or in a regionadjacent a corner between the third lateral surface 1725 and the fourthlateral surface 1726. In an example embodiment, the third antenna module1750 may include one type of antenna (e.g., a patch antenna). The thirdantenna module 1750 may radiate the signal to the first surface 1721,the second surface 1722, or the third lateral surface 1725 of theelectronic device 1701. In another embodiment, the third antenna module1750 may include a first type antenna and a second type antenna.

The configurations or features of the second antenna module 1740 and thethird antenna module 1750 may be the same as or similar to those of thesecond antenna module 140 and the third antenna module 150 in FIGS. 6,7, 8 and 9.

FIG. 18 is a diagram illustrating example placements of the firstantenna module and the third antenna module on the third lateral surfaceaccording to various embodiments.

Referring to FIG. 18, the third lateral surface 1725 may include acurved portion 1830 c of the second plate 1830, a conductive structure1820, and a curved portion 1810 c of the first plate 1810.

For example, in a portion of the third lateral surface 1725 adjacent tothe first antenna module 1730, a height (or a thickness) H_171 of thecurved portion 1830 c of the second plate 1830 may be equal to orgreater than a height (or a thickness) H_172 of the conductive structure1820. The height H_171 of the curved portion 1830 c of the second plate1830 may be equal to or greater than a height (or a thickness) H_173 ofcurved portion 1810 c of the first plate 1810.

According to various embodiments, the conductive structure 1820 mayinclude an opening through which a button 1825 may be exposed.

According to various embodiments, the first antenna module 1730 may bedisposed adjacent to a corner between the first lateral surface (thefirst lateral surface 1723 of FIG. 17) and the third lateral surface1725. The first antenna module 1730 may include two different types ofantennas (e.g., a patch antenna and dipole antenna).

According to various embodiments, the first antenna module 1730 may becloser to the second plate 1830 than to the first plate 1810 in theelectronic device 1701. The first antenna module 1730 may radiate themmWave signal through the second plate 1830 or the curved portion 1830 cof the second plate 1830.

According to various embodiments, the third antenna module 1750 may bedisposed adjacent to a center or a bottom of the third lateral surface1725 (region adjacent to the fourth lateral surface 1726 of FIG. 17). Inan example embodiment, the third antenna module 1750 may include onetype of antenna (e.g., a patch antenna). The third antenna module 1750may radiate the signal to the first surface 1721, the second surface1722, or the third lateral surface 1725 of the electronic device 1701.

According to various embodiments, the first antenna module 1730 may bedisposed in a first direction of the button 1825. The third antennamodule 1750 may be disposed in a second direction (opposite to the firstdirection) of the button 1825.

FIG. 19 is a diagram illustrating an example placement mode of the firstantenna module according to various embodiments. FIG. 19 is illustrativeand the disclosure is not limited thereto.

Referring to FIG. 19, in a region adjacent to the first lateral surface1723 and the third lateral surface 1725, the electronic device 1701 mayinclude the conductive structure 1820, the first antenna module 1730, aflexible printed circuit board 1920, a connector 1930, and the mainsubstrate 1780.

The conductive structure 1820 may form a portion of the lateral surfaceof the housing 1720. The conductive structure 1820 may be used as anantenna radiator for transmitting and receiving a signal of a specifiedfrequency band. For example, the conductive structure 1820 may act as anantenna radiator for signals for 4G or 3G communication (e.g., 6 GHz orlower).

According to various embodiments, the first antenna module 1730 mayinclude a first type antenna 1731 (e.g., a patch antenna) and a secondtype antenna 1732 (e.g., a dipole antenna).

The first type antenna 1731 may be a patch antenna disposed such thatthe first radiating surface or patch surface 1731 a is directed towardthe second plate 1830. The first type antenna 1731 may radiate an mmWavesignal through the second plate 1830.

The second type antenna 1732 may be a dipole antenna disposed so thatthe second radiating surface 1732 a is directed toward the third lateralsurface 1725. The second type antenna 1732 may radiate the mmWave signalthrough the second plate 1830 or the curved portion 1830 c (refer toFIG. 18) of the second plate 1830.

The flexible printed circuit board 1920 may transmit a signaltransmitted and received by the first antenna module 1730. The connector1930 may electrically connect the flexible printed circuit board 1920and the main substrate 1780 with each other.

Elements such as a communication circuit, processor or memory may bemounted on the main substrate 1780, and electrically connected with eachother via the main substrate 1780. The main substrate 1780 may beelectrically connected to the first antenna module 1730 via the flexibleprinted circuit board 1920 and connector 1930.

FIG. 20 is a cross-sectional view illustrating an example regionadjacent to the first antenna module according to various embodiments.

Referring to FIG. 20, in a region adjacent to the first antenna module1730, the electronic device 1701 may include the first plate 1810, theconductive structure 1820, the second plate 1830, the first antennamodule 1730, a bracket 1770, or the main substrate 1780.

The first plate 1810 may include a non-conductive material (e.g., glassor plastic). The first plate 1810 may have a planar portion 1810 n alongand on the first surface 1721 of the housing 1720. The first plate 1810may at least partially extend to the third lateral surface 1725 todefine the curved portion 1810 c. The curved portion 1810 c may have acurved surface shape with a specified curvature.

The conductive structure 1820 may form a portion of the third lateralsurface 1725 of the housing 1720. The conductive structure 1820 may beused as an antenna radiator for 4G or 3G communication.

The second plate 1830 may include a non-conductive material (e.g., glassor plastic). The second plate 1830 may have a planar portion 1830 nalong and on the second surface 1722 of the housing 1720. The secondplate 1830 may at least partially extend to the third lateral surface1725 to define the curved portion 1830 c. The curved portion 1830 c mayhave a curved surface shape having a specified curvature.

The conductive structure 1820 of the housing 1720 may be in contact withthe curved portion 1830 c of the second plate 1830 at one end (a rearend) of the conductive structure 1820. The conductive structure 1820 maycontact the curved portion 1810 c of the first plate 1810 at the otherend (a front end) of the conductive structure 1820.

In the third lateral surface 1725, a height (or a thickness) of thecurved portion 1830 c of the second plate 1830 may be greater than aheight (or a thickness) of the curved portion 1810 c of the first plate1810 or the conductive structure 1820. The curved portion 1830 c of thesecond plate 1830 may be a window through which the mmWave signal fromthe first antenna module 1730 is radiated.

The first antenna module 1730 may have a first radiating surface 1731 a.The first radiating surface 1731 a may be a surface from which the firsttype antenna (e.g., a patch antenna) radiates the mmWave signal. Thesecond radiating surface 1732 a may be a surface being directed towardthe second surface 1722 of the housing 1720. A radiating space (or anair gap) 1730 a may be defined between the first radiating surface 1731a of the first antenna module 1730 and the second plate 1830. The firsttype antenna (e.g., a patch antenna 1731) may radiate the mmWave signalthrough radiating space (or an air gap) 1730 a.

The first antenna module 1730 may have the second radiating surface 1732a. The second radiating surface 1732 a may be a surface from which thesecond type antenna (e.g., dipole antenna) radiates an mmWave signal.The second radiating surface 1732 a may be a surface being directedtoward the third lateral surface 1725 of the housing 1720.

The bracket or support structure 1770 may fix the first antenna module1730 and define the radiating space (or an air gap) 1730 a.

On the main substrate 1780, the first antenna module 1730 may bemounted. The first antenna module 1730 may be electrically connected toa communication circuit and a processor via the main substrate 1780.

FIG. 21 is a diagram illustrating example placement tilt change of thesecond antenna module according to various embodiments. FIG. 21 isillustrative and the disclosure is not limited thereto.

Referring to FIG. 21, in a first placement mode 2101, the second antennamodule 1740 may have a first radiating surface 1741 a perpendicular tothe planar portion 1830 n of the second plate 1830 or the planar portion1810 n of the first plate 1810. A first angle θ1 between the firstradiating surface 1741 a and the planar portion 1830 n of the secondplate 1830 may be 90 degrees. The first radiating surface 1741 a may bea surface from which the first type antenna (e.g., a patch antenna)radiates the mmWave signal.

The second antenna module 1740 may radiate the mmWave signal through aradiating member (e.g., a PC (polycarbonate) part) 2111 and a curvedportion 1830 b of the second plate 1830. A first surface 2111 a of theradiating member 2111 being directed toward the first radiating surface1741 a of the second antenna module 1740 may have a shape parallel tothe first radiating surface 1741 a. A radiating space (or an air gap)1740 a 1 may be formed between the first surface 2111 a of the radiatingmember 2111 and the first radiating surface 1741 a of the second antennamodule 1740.

In a second placement mode 2102, the second antenna module 1740 may havea tilted first radiating surface 1741 a that is not perpendicular to theplanar portion 1830 n of second plate 1830 or the planar portion 1810 nof first plate 1810. The second antenna module 1740 may be inclined suchthat the first radiating surface 1741 a is directed toward a positionbetween the planar portion 1830 n and the curved portion 1830 b of thesecond plate 1830. The first radiating surface 1741 a of the secondantenna module 1740 may form a second angle θ2>90 degrees with respectto the planar portion 1830 n of the second plate 1830.

According to various embodiments, a radiating member (e.g., the PC part)2112 may be changed in shape in a corresponding manner to an angle atwhich the second antenna module 1740 is inclined. For example, a firstsurface 2112 a of the radiating member 2112 being directed toward thefirst radiating surface 1741 a of the second antenna module 1740 mayhave a shape parallel to the first radiating surface 1741 a. A radiatingspace (or an air gap) 1740 a 2 may be formed between the first surface2112 a of the radiating member 2112 and the first radiating surface 1741a of the second antenna module 1740.

In a third placement mode 2103, the second antenna module 1740 may havean inclined first radiating surface 1741 a that is not perpendicular tothe planar portion 1830 n of the second plate 1830 or the planar portion1810 n of the first plate 1810. The first radiating surface 1741 a ofthe second antenna module 1740 may form a third angle θ3 with respect tothe planar portion 1830 n of the second plate 1830 (θ2<θ3).

According to various embodiments, a radiating member (e.g., the PC part2113) may be changed in shape corresponding to an angle at which thesecond antenna module 1740 is inclined. For example, a first surface2113 a of the radiating member 2113 being directed toward the firstradiating surface 1741 a of the second antenna module 1740 may have ashape parallel to the first radiating surface 1741 a.

When the second antenna module 1740 is mounted in a tilted manner in thesecond placement mode 2102 or the third placement mode 2103, the firstradiating surface 1741 a may be moved away from the conductive structure1820, so that the radiating performance of the mmWave signal may beimproved. Further, in a corresponding manner to the placement mode ofthe second antenna module 1740, a thicknesses of each of the radiatingmembers (e.g., the PC part) 2112 and 2113 become relatively smaller, oreach of the radiating members (e.g., the PC part) 2112 and 2113 may havean even thickness over the entire first radiating surface 1741 a. Inthis way, the radiating performance of the mmWave signal may beimproved.

FIG. 22 is a diagram illustrating formation of radiating space at theradiating surface of the second antenna module according to variousembodiments. FIG. 22 is illustrative and the disclosure is not limitedthereto.

Referring to FIG. 22, in a first placement mode 2201, the second antennamodule 1740 may have the first radiating surface 1741 a perpendicular tothe planar portion 1830 n of the second plate 1830 or the planar portion1810 n of the first plate 1810. The first radiating surface 1741 a maybe a surface from which the first type antenna (e.g., a patch antenna)radiates the mmWave signal. The second antenna module 1740 may radiatethe mmWave signal through a radiating member (e.g., the PC(polycarbonate) part) 2211 and the curved portion 1830 b of the secondplate 1830).

According to various embodiments, a first surface 2211 a of theradiating member 2211 being directed toward first radiating surface 1741a may have a shape parallel to first radiating surface 1741 a. The firstsurface 2211 a of the radiating member 2211 and the planar portion 1830n of the second plate 1830 may be perpendicular to each other. A firstangle α1 between the first surface 2211 a of the radiating member 2211and the planar portion 1830 n of the second plate 1830 may be 90degrees. A radiating space (or an air gap) 1740 a 4 may be formedbetween the first surface 2211 a of the radiating member 2111 and thefirst radiating surface 1741 a of the second antenna module 1740.

In a second placement mode 2202, at least a portion of the surface of aradiating member 2212 as directed toward the first radiating surface1741 a of the second plate 1830 may not be parallel to the firstradiating surface 1741 a of the second antenna module 1740. For example,at least a portion of the surface of the radiating member 2211 asdirected toward the first radiating surface 1741 a of the second plate1830 may be construed to be away (depressed) from the first radiatingsurface 1741 a. A first portion 2212 a of the surface of the radiatingmember 2211 as directed toward the first radiating surface 1741 a mayform the second angle α2>90 degrees with respect to the planar portion1830 n of the second plate 1830.

When the surface of the radiating member 2212 directed towards the firstradiating surface 1741 a is depressed, a radiating space (or an air gap)1740 a 5 defined between the radiating member 2112 and the firstradiating surface 1741 a of the second antenna module 1740 may be largerthan that in the first placement mode 2201.

In a third placement mode 2203, the surface of a radiating member 2213as directed toward the first radiating surface 1741 a of the secondplate 1830 may be at least partially non-parallel to the first radiatingsurface 1741 a of the second antenna module 1740. For example, a firstportion 2213 a of the surface of the radiating member 2213 as directedtoward the first radiating surface 1741 a may form a third angle α3 withrespect to the planar portion 1830 n of the second plate 1830 (α2<α3).As the third angle α3 increases, the radiating space (or an air gap)1740 a 6 may increase.

As in the second placement mode 2202 or third placement mode 2203, thelarger the radiating space (or an air gap) 1740 a 5 or 1740 a 6, thebetter the radiating performance of the mmWave signal. Further, in acorresponding manner to the placement mode of the second antenna module1740, a thickness of the radiating member (e.g., the PC part) 2212 or2213 becomes relatively smaller, or the radiating member (e.g., the PCpart) 2212 or 2213 may have an even thickness over the entire firstradiating surface 1741 a. In this way, the radiating performance of themmWave signal may be improved.

According to various embodiments, features relating to the secondantenna module 1740 of FIG. 21 and FIG. 22 may be applied equally orsimilarly to the third antenna module 1750 in FIG. 17.

An electronic device may include, for example, and without limitation,at least one of, for example, a portable communication device (e.g., asmartphone, a computer device (e.g., a PDA: personal digital assistant),a tablet PC, a laptop PC, a desktop PC, a workstation, or a server), aportable multimedia device (e.g., e-book reader or MP3 player), aportable medical device (e.g., heart rate, blood sugar, blood pressure,or body temperature measuring device), a camera, or a wearable device.The wearable device may include at least one of an accessory type device(e.g., watches, rings, bracelets, anklets, necklaces, glasses, contactlenses, or head wearable device head-mounted-device (HMD)), a fabric orclothing integral device (e.g., an electronic clothing), a body-attacheddevice (e.g., skin pads or tattoos), or an bio implantable circuit. Insome embodiments, the electronic device may include at least one of, forexample, and without limitation, a television, a DVD (digital videodisk) player, an audio device, an audio accessory device (e.g., aspeaker, headphones, or a headset), a refrigerator, an air conditioner,a cleaner, an oven, a microwave oven, a washing machine, an airpurifier, a set top box, a home automation control panel, a securitycontrol panel, a game console, an electronic dictionary, an electronickey, a camcorder, or an electronic picture frame.

In another embodiment, the electronic device may include, for example,and without limitation, at least one of a navigation device, GNSS(global navigation satellite system), an EDR (event data recorder (e.g.,black box for vehicle/ship/airplane), an automotive infotainment device(e.g., vehicle head-up display), an industrial or home robot, a drone,ATM (automated teller machine), a POS (point of sales) instrument, ameasurement instrument (e.g., water, electricity, or gas measurementequipment), or an Internet of Things device (e.g. bulb, sprinklerdevice, fire alarm, temperature regulator, or street light). Theelectronic device according to the embodiment of the disclosure is notlimited to the above-described devices. Further, for example, as in asmart phone equipped with measurement of biometric information (e.g., aheart rate or blood glucose) of an individual, the electronic device mayhave a combination of functions of a plurality of devices. In thedisclosure, the term “user” may refer to a person using the electronicdevice or a device (e.g., an artificial intelligence electronic device)using the electronic device.

FIG. 23 is a block diagram illustrating an example electronic device2301 (e.g., the electronic device 101 of FIG. 1, the electronic device1101 of FIG. 11, the electronic device 1201 of FIG. 12, and theelectronic device 1701 of FIG. 17) in a network environment 2300according to various embodiments. Referring to FIG. 23, the electronicdevice 2301 may communicate with an electronic device 2302 through afirst network 2398 (e.g., a short-range wireless communication network)or may communicate with an electronic device 2304 or a server 2308through a second network 2399 (e.g., a long-distance wirelesscommunication network) in the network environment 2300. According to anembodiment, the electronic device 2301 may communicate with theelectronic device 2304 through the server 2308. According to anembodiment, the electronic device 2301 may include a processor 2320, amemory 2330, an input device 2350, a sound output device 2355, a displaydevice 2360, an audio module 2370, a sensor module 2376, an interface2377, a haptic module 2379, a camera module 2380, a power managementmodule 2388, a battery 2389, a communication module 2390, a subscriberidentification module 2396, or an antenna module 2397 (e.g., the antennamodules 130, 140 and 150 of FIG. 1 and the antenna modules 1730, 1740,and 1750 of FIG. 17). According to some embodiments, at least one (e.g.,the display device 2360 or the camera module 2380) among components ofthe electronic device 2301 may be omitted or one or more othercomponents may be added to the electronic device 2301. According to someembodiments, some of the above components may be implemented with oneintegrated circuit. For example, the sensor module 2376 (e.g., afingerprint sensor, an iris sensor, or an illuminance sensor) may beembedded in the display device 2360 (e.g., a display).

The processor 2320 may execute, for example, software (e.g., a program2340) to control at least one of other components (e.g., a hardware orsoftware component) of the electronic device 2301 connected to theprocessor 2320 and may process or compute a variety of data. Accordingto an embodiment, as a part of data processing or operation, theprocessor 2320 may load a command set or data, which is received fromother components (e.g., the sensor module 2376 or the communicationmodule 2390), into a volatile memory 2332, may process the command ordata loaded into the volatile memory 2332, and may store result datainto a nonvolatile memory 2334. According to an embodiment, theprocessor 2320 may include a main processor 2321 (e.g., a centralprocessing unit or an application processor) and an auxiliary processor2323 (e.g., a graphic processing device, an image signal processor, asensor hub processor, or a communication processor), which operatesindependently from the main processor 2321 or with the main processor2321. Additionally or alternatively, the auxiliary processor 2323 mayuse less power than the main processor 2321, or is specified to adesignated function. The auxiliary processor 2323 may be implementedseparately from the main processor 2321 or as a part thereof.

The auxiliary processor 2323 may control, for example, at least some offunctions or states associated with at least one component (e.g., thedisplay device 2360, the sensor module 2376, or the communication module2390) among the components of the electronic device 2301 instead of themain processor 2321 while the main processor 2321 is in an inactive(e.g., sleep) state or together with the main processor 2321 while themain processor 2321 is in an active (e.g., an application execution)state. According to an embodiment, the auxiliary processor 2323 (e.g.,the image signal processor or the communication processor) may beimplemented as a part of another component (e.g., the camera module 2380or the communication module 2390) that is functionally related to theauxiliary processor 2323.

The memory 2330 may store a variety of data used by at least onecomponent (e.g., the processor 2320 or the sensor module 2376) of theelectronic device 2301. For example, data may include software (e.g.,the program 2340) and input data or output data with respect to commandsassociated with the software. The memory 2330 may include the volatilememory 2332 or the nonvolatile memory 2334.

The program 2340 may be stored in the memory 2330 as software and mayinclude, for example, an operating system 2342, a middleware 2344, or anapplication 2346.

The input device 2350 may receive a command or data, which is used for acomponent (e.g., the processor 2320) of the electronic device 2301, froman outside (e.g., a user) of the electronic device 2301. The inputdevice 2350 may include, for example, a microphone, a mouse, a keyboard,or a digital pen (e.g., a stylus pen).

The sound output device 2355 may output a sound signal to the outside ofthe electronic device 2301. The sound output device 2355 may include,for example, a speaker or a receiver. The speaker may be used forgeneral purposes, such as multimedia play or recordings play, and thereceiver may be used for receiving calls. According to an embodiment,the receiver and the speaker may be either integrally or separatelyimplemented.

The display device 2360 may visually provide information to the outside(e.g., the user) of the electronic device 2301. For example, the displaydevice 2360 may include a display, a hologram device, or a projector anda control circuit for controlling a corresponding device. According toan embodiment, the display device 2360 may include a touch circuitryconfigured to sense the touch or a sensor circuit (e.g., a pressuresensor) for measuring an intensity of pressure on the touch.

The audio module 2370 may convert a sound and an electrical signal indual directions. According to an embodiment, the audio module 2370 mayobtain the sound through the input device 2350 or may output the soundthrough the sound output device 2355 or an external electronic device(e.g., the electronic device 2302 (e.g., a speaker or a headphone))directly or wirelessly connected to the electronic device 2301.

The sensor module 2376 may generate an electrical signal or a data valuecorresponding to an operating state (e.g., power or temperature) insideor an environmental state (e.g., a user state) outside the electronicdevice 2301. According to an embodiment, the sensor module 2376 mayinclude, for example, a gesture sensor, a gyro sensor, a barometricpressure sensor, a magnetic sensor, an acceleration sensor, a gripsensor, a proximity sensor, a color sensor, an infrared sensor, abiometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor.

The interface 2377 may support one or more designated protocols to allowthe electronic device 2301 to connect directly or wirelessly to theexternal electronic device (e.g., the electronic device 2302). Accordingto an embodiment, the interface 2377 may include, for example, an HDMI(high-definition multimedia interface), a USB (universal serial bus)interface, an SD card interface, or an audio interface.

A connecting terminal 2378 may include a connector that physicallyconnects the electronic device 2301 to the external electronic device(e.g., the electronic device 2302). According to an embodiment, theconnecting terminal 2378 may include, for example, an HDMI connector, aUSB connector, an SD card connector, or an audio connector (e.g., aheadphone connector).

The haptic module 2379 may convert an electrical signal to a mechanicalstimulation (e.g., vibration or movement) or an electrical stimulationperceived by the user through tactile or kinesthetic sensations.According to an embodiment, the haptic module 2379 may include, forexample, a motor, a piezoelectric element, or an electric stimulator.

The camera module 2380 may shoot a still image or a video image.According to an embodiment, the camera module 2380 may include, forexample, at least one or more lenses, image sensors, image signalprocessors, or flashes.

The power management module 2388 may manage power supplied to theelectronic device 2301. According to an embodiment, the power managementmodule 2388 may be implemented as at least a part of a power managementintegrated circuit (PMIC).

The battery 2389 may supply power to at least one component of theelectronic device 2301. According to an embodiment, the battery 2389 mayinclude, for example, a non-rechargeable (primary) battery, arechargeable (secondary) battery, or a fuel cell.

The communication module 2390 may establish a direct (e.g., wired) orwireless communication channel between the electronic device 2301 andthe external electronic device (e.g., the electronic device 2302, theelectronic device 2304, or the server 2308) and support communicationexecution through the established communication channel. Thecommunication module 2390 may include at least one communicationprocessor operating independently from the processor 2320 (e.g., theapplication processor) and supporting the direct (e.g., wired)communication or the wireless communication. According to an embodiment,the communication module 2390 may include a wireless communicationmodule 2392 (e.g., a cellular communication module, a short-rangewireless communication module, or a GNSS (global navigation satellitesystem) communication module) or a wired communication module 2394(e.g., an LAN (local area network) communication module or a power linecommunication module). The corresponding communication module among theabove communication modules may communicate with the external electronicdevice 2304 through the first network 2398 (e.g., the short-rangecommunication network such as a Bluetooth, a WiFi direct, or an IrDA(infrared data association)) or the second network 2399 (e.g., thelong-distance wireless communication network such as a cellular network,an internet, or a computer network (e.g., LAN or WAN)). Theabove-mentioned various communication modules may be implemented intoone component (e.g., a single chip) or into separate components (e.g.,chips), respectively. The wireless communication module 2392 mayidentify and authenticate the electronic device 2301 using userinformation (e.g., international mobile subscriber identity (IMSI))stored in the subscriber identification module 2396 in the communicationnetwork, such as the first network 2398 or the second network 2399.

The antenna module 2397 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device). According to anembodiment, the antenna module 2397 may include an antenna including aradiating element composed of a conductive material or a conductivepattern formed in or on a substrate (e.g., PCB). According to anembodiment, the antenna module 2397 may include a plurality of antennas.In such a case, at least one antenna appropriate for a communicationscheme used in the communication network, such as the first network 2398or the second network 2399, may be selected, for example, by thecommunication module 2390 from the plurality of antennas. The signal orthe power may then be transmitted or received between the communicationmodule 2390 and the external electronic device via the selected at leastone antenna. According to an embodiment, another component (e.g., aradio frequency integrated circuit (RFIC)) other than the radiatingelement may be additionally formed as part of the antenna module 2397.

At least some components among the components may be connected to eachother through a communication method (e.g., a bus, a GPIO (generalpurpose input and output), an SPI (serial peripheral interface), or anMIPI (mobile industry processor interface)) used between peripheraldevices to exchange signals (e.g., a command or data) with each other.

According to an embodiment, the command or data may be transmitted orreceived between the electronic device 2301 and the external electronicdevice 2304 through the server 2308 connected to the second network2399. Each of the electronic devices 2302 and 2304 may be the same ordifferent types as or from the electronic device 2301. According to anembodiment, all or some of the operations performed by the electronicdevice 2301 may be performed by one or more external electronic devicesamong the external electronic devices 2302, 2304, or 2308. For example,when the electronic device 2301 performs some functions or servicesautomatically or by request from a user or another device, theelectronic device 2301 may request one or more external electronicdevices to perform at least some of the functions related to thefunctions or services, in addition to or instead of performing thefunctions or services by itself. The one or more external electronicdevices receiving the request may carry out at least a part of therequested function or service or the additional function or serviceassociated with the request and transmit the execution result to theelectronic device 2301. The electronic device 2301 may provide theresult as is or after additional processing as at least a part of theresponse to the request. To this end, for example, a cloud computing,distributed computing, or client-server computing technology may beused.

An electronic device according to various example embodiments (e.g., theelectronic device 101 of FIG. 1) may include a display (e.g., thedisplay 110 of FIG. 1), a housing (e.g., the housing 120 of FIG. 1)having a first surface (e.g., the first surface 121 of FIG. 1) throughwhich the display (e.g., the display 110 of FIG. 1) is viewable to anoutside, a second surface (e.g., the second surface 122 in FIG. 1)opposite the first surface e.g., the first surface 121 of FIG. 1),lateral surfaces between the first surface (e.g., the first surface 121of FIG. 1) and the second surface (e.g., the second surface 122 of FIG.1), a first antenna module including at least one antenna (e.g., thefirst antenna module 130 of FIG. 1) disposed adjacent to a first lateralsurface (e.g., the first lateral surface 123 of FIG. 1) of the lateralsurfaces inside the housing (e.g., the housing 120 of FIG. 1), and asecond antenna module including at least one antenna (e.g., the secondantenna module 140 of FIG. 1) disposed adjacent to a second lateralsurface (e.g., the second lateral surface 124 of FIG. 1) of the lateralsurfaces inside the housing (e.g., the housing 120 of FIG. 1). Thehousing (e.g., the housing 120 in FIG. 1) may include a first plate(e.g., the first plate 210 in FIG. 2) covering the first surface (e.g.,the first surface 121 in FIG. 1), a second plate (e.g., the secondsurface 230 of FIG. 2) covering the second surface (e.g., the secondsurface 122 in FIG. 1), and a conductive structure comprising aconductive material (e.g., the conductive structure 220 in FIG. 2)disposed between the first surface (e.g., the first surface 121 ofFIG. 1) and the second surface (e.g., the second surface 122 of FIG. 1)and at least partially exposed to the outside through the lateralsurfaces. A height of a portion of the second plate (e.g., the secondplate 230 in FIG. 2) extending in and along the first lateral surface(e.g., the first lateral surface 123 in FIG. 1) may be less than aheight of a portion of the second plate (e.g., the second plate 230 inFIG. 2) extending in and along the second lateral surface (e.g., thesecond lateral surface 124 in FIG. 1).

According to various example embodiments, each of the first antennamodule (e.g., the first antenna module 130 of FIG. 1) and the secondantenna module (e.g., the second antenna module 140 of FIG. 1) may beconfigured to transmit and receive a signal of a mmWave frequency bandas a first frequency band.

According to various example embodiments, at least a portion of theconductive structure (e.g., the conductive structure 220 of FIG. 2) mayinclude an antenna radiator configured to transmit and receive a signalof a second frequency band other than the first frequency band.

According to various example embodiments, a height of a portion of thesecond plate (e.g., the second plate 230 of FIG. 2) extending in andalong the first lateral surface (e.g., the first lateral surface 123 ofFIG. 1) may be less than a height of the conductive structure (e.g., theconductive structure 220 of FIG. 2) defining the first lateral surface(e.g., the first lateral surface 123 of FIG. 1).

According to various example embodiments, a height of a portion of thefirst plate (e.g., the first plate 210 of FIG. 2) extending in and alongthe first lateral surface (e.g., the first lateral surface 123 ofFIG. 1) may be less than a height of the conductive structure (e.g., theconductive structure 220 of FIG. 2) of the first lateral surface (e.g.,the first lateral surface 123 of FIG. 1) or a height of a portion of thesecond plate (e.g., the second plate 230 of FIG. 2) extending in andalong the first lateral surface (e.g., the first lateral surface 123 ofFIG. 1).

According to various example embodiments, a height of a portion of thesecond plate (e.g., the second plate 230 of FIG. 2) extending in andalong the second lateral surface (e.g., the second lateral surface 124of FIG. 1) may be greater than a height of a portion of the second plate(e.g., the second plate 230 in FIG. 2) extending in and along the firstlateral surface (e.g., the first lateral surface 123 of FIG. 1).

According to various example embodiments, the first lateral surface(e.g., the first lateral surface 123 of FIG. 1) may be perpendicular tothe second lateral surface (e.g., the second lateral surface 124 of FIG.1).

According to various example embodiments, a height of a portion of thesecond plate (e.g., the second plate 230 of FIG. 2) extending in andalong the second lateral surface (e.g., the second lateral surface 124of FIG. 1) may be greater than a height of the conductive structure(e.g., the conductive structure 220 in FIG. 2) defining the secondlateral surface (e.g., the second lateral surface 124 of FIG. 1).

According to various example embodiments, a height of a portion of thesecond plate (e.g., the second plate 230 of FIG. 2) extending in andalong the second lateral surface (e.g., the second lateral surface 124of FIG. 1) may be greater than a height of a portion of the first plate(e.g., the first plate 210 of FIG. 2) extending in and along the secondlateral surface (e.g., the second lateral surface 124 of FIG. 1).

According to various example embodiments, the first antenna module(e.g., the first antenna module 130 of FIG. 1) may include a first typeantenna (e.g., the first type antenna 131 of FIG. 3) and a second typeantenna (e.g., the second type antenna 132 of FIG. 3), the first typeantenna having different radiating surfaces than the second typeantenna.

According to various example embodiments, the first type antenna (e.g.,the first type antenna 131 of FIG. 3) includes a radiating surfacedirected toward the second surface (e.g., the second surface 122 of FIG.1). The second type antenna (e.g., the second type antenna 132 of FIG.3) may include a radiating surface directed toward the first lateralsurface (e.g., the first lateral surface 123 of FIG. 1).

According to various example embodiments, the first type antenna (e.g.,the first type antenna 131 of FIG. 3) may include a patch antenna, andthe second type antenna (e.g., the second type antenna 132 in FIG. 3)may include a dipole antenna.

According to various example embodiments, the second antenna module(e.g., the second antenna module 140 of FIG. 1) may include a first typeantenna having a radiating surface directed toward the second lateralsurface (e.g., the second lateral surface 124 of FIG. 1). The first typeantenna may include a patch antenna.

According to various example embodiments, the electronic device (e.g.,the electronic device 101 of FIG. 1) may further include a third antennamodule (e.g., the third antenna module 150 in FIG. 1) including at leastone antenna disposed adjacent to a third lateral surface (e.g., thethird lateral surface 125 of FIG. 1) of the lateral surfaces opposite tothe second lateral surface (e.g., the second lateral surface 124 inFIG. 1) within a housing (e.g., the housing 120 in FIG. 1). A height ofa portion of the second plate (e.g., the second plate 230 of FIG. 2)extending in and along the third lateral surface (e.g., the thirdlateral surface 125 of FIG. 1) may be equal to a height of a portion ofthe second plate (e.g., the second plate 230 of FIG. 2) extending in andalong the second lateral surface (e.g., the second lateral surface 124of FIG. 1).

According to various example embodiments, a height of the conductivestructure surfaces (e.g., the conductive structure 220 in FIG. 2)defining a fourth lateral surface (e.g., the fourth lateral surface 126in FIG. 1) of the lateral surfaces opposite to the first lateral surface(e.g., the first lateral surface 123 of FIG. 1) within the housing(e.g., the housing 120 of FIG. 1) may be greater than a height of aportion of the first plate (e.g., the first plate 210 of FIG. 2)extending in and along the fourth lateral surface (e.g., the fourthlateral surface 126 of FIG. 1) or a height of a portion of the secondplate (e.g., the second plate 230 in FIG. 2) extending in and along thefourth lateral surface (e.g., the fourth lateral surface 126 of FIG. 1).

According to various example embodiments, the electronic device (e.g.,the electronic device 101 of FIG. 1) may further include alight-emission element including light emitting circuitry (e.g., thelight-emission element 1250 of FIG. 12) configured to emit light towardthe second surface (e.g., the second surface 122 of FIG. 1) based on anoperation state of the first antenna module (e.g., the first antennamodule 130 of FIG. 1) or the second antenna module (e.g., the secondantenna module 140 of FIG. 1)

An electronic device (e.g., the electronic device 1701 of FIG. 17)according to various example embodiments may include a display (e.g.,the display 1710 of FIG. 17), a housing (e.g., the housing 1720 of FIG.17) including a first surface through which at least a portion of thedisplay is viewable (e.g., the display 1710 in FIG. 17), a secondsurface facing the first surface, and lateral surfaces (e.g., thelateral surfaces 1723, 1724, 1725 and 1726 in FIG. 17) surrounding aspace between the first surface and the second surface, wherein thehousing (e.g., the housing 1720 in FIG. 17) includes a first plate(e.g., the first plate 1810 of FIG. 18) defining the first surface, asecond plate (e.g., the second plate 1830 of FIG. 18) defining thesecond surface, and a conductive structure comprising a conductivematerial (e.g., the conductive structure 1820 of FIG. 18) disposedbetween the first surface and the second surface and defining at leastsome lateral surfaces, a first antenna module comprising at least oneantenna (e.g., the first antenna module 1730 in FIG. 17) disposedadjacent to a first lateral surface (e.g., the first lateral surface1723 of FIG. 17) of the lateral surfaces inside the housing (e.g., thehousing 1720 of FIG. 17), and a second antenna module comprising atleast one antenna (e.g., the third antenna module 1750 in FIG. 17)disposed adjacent to a second lateral surface (e.g., the third lateralsurface 1725 of FIG. 17) of the lateral surfaces inside the housing(e.g., the housing 1720 of FIG. 17), wherein the first antenna module(e.g., the first antenna module 1730 in FIG. 17) includes a first typeantenna including a first radiating surface directed toward the secondsurface (e.g., the second surface 1722 in FIG. 17) and a second typeantenna including a second radiating surface directed toward the secondlateral surface.

According to various example embodiments, the second radiating surfacemay be arranged to overlap with a portion of the second plate (e.g., thesecond plate 1830 of FIG. 18) extending to the second lateral surfacewhen viewed from the second lateral surface.

According to various example embodiments, the housing (e.g., the housing1720 of FIG. 17) may include an opening included in the second lateralsurface (e.g., the third lateral surface 1725 of FIG. 17) and configuredto expose a physical button, wherein the second radiating surface may bedisposed in a first direction of the opening, wherein a third radiatingsurface of the second antenna module (e.g., the third antenna module1750 in FIG. 17) may be provided in a second direction of the opening.

An electronic device (e.g., the electronic device 1701 of FIG. 17)according to various example embodiments may include a housing (e.g.,the housing 1720 of FIG. 17) including a first plate (e.g., the firstplate 1810 of FIG. 18) including a first planar portion and a firstcurved portion extending from the first planar portion, a second plate(e.g., the second plate 1830 of FIG. 18) including a second planarportion and a second curved portion extending from the second planarportion, and a conductive structure comprising a conductive material(e.g., the conductive structure 1820 in FIG. 18) disposed between thefirst plate (e.g., the first plate 1810 of FIG. 18) and the second plate(e.g., the second plate 1830 of FIG. 18) and defining at least somelateral surfaces of the electronic device (e.g., the electronic device1701 of FIG. 17), an antenna module including at least one antenna(e.g., the second antenna module 1740 in FIG. 17) disposed adjacent to afirst lateral surface (e.g., the second lateral surface 1724 of FIG. 17)of the lateral surfaces inside the housing (e.g., the housing 1720 ofFIG. 17), and a wireless communication circuit electrically connectedwith the antenna module (e.g., the second antenna module 1740 of FIG.17), wherein the wireless communication circuit is configured totransmit and receive at least one signal having a frequency between 6GHz and 100 GHz through the antenna module (e.g., the second antennamodule 1740 in FIG. 17), wherein the antenna module (e.g., the secondantenna module 1740 in FIG. 17) is fixed by a support disposed insidethe housing (e.g., the housing 1720 in FIG. 17), wherein when viewedfrom the first lateral surface (e.g., the second lateral surface 1724 ofFIG. 17), at least a portion of the antenna module (e.g., the secondantenna module 1740 of FIG. 17) is positioned to overlap the secondcurved portion, wherein the second curved portion covers an area of atleast half of the first lateral surface (e.g., the second lateralsurface 1724 of FIG. 17), wherein the second plate (e.g., the secondplate 1830 in FIG. 18) includes an inorganic oxide.

According to an example embodiment, the electronic device (e.g., theelectronic device 1701 of FIG. 17) may further include a display (e.g.,the display 1710 of FIG. 17), wherein the first plate (e.g., the firstplate 1810 in FIG. 18) may include a glass cover that covers the display(e.g., the display 1710 in FIG. 17), wherein the second plate (e.g., thesecond plate 1830 in FIG. 18) may be a back cover.

According to another example embodiment, the electronic device (e.g.,the electronic device 1701 of FIG. 17) may further include a display(e.g., the display 1710 of FIG. 17), wherein the second plate (e.g., thesecond plate 1830 in FIG. 18) may be a glass cover that covers thedisplay (e.g., the display 1710 in FIG. 17), wherein the first plate(e.g., the first plate 1810 in FIG. 18) may be a back cover.

According to various example embodiments, the inorganic oxide may beinclude least one of glass, ceramic, sapphire.

According to various embodiments, the antenna module (e.g., the secondantenna module 1740 of FIG. 17) may include, in the first lateralsurface (e.g., the second lateral surface 1724 of FIG. 17),non-conductive members comprising non-conductive material (e.g., theradiating members 2111, 2112, and 2113 in FIG. 21) between the secondcurved portion and the radiating surface of the antenna module (e.g.,the second antenna module 1740 of FIG. 17). An air gap may be definedbetween the non-conductive member (e.g., the radiating members 2111,2112, 2113 in FIG. 21), the second curved portion, and the radiatingsurface.

According to various example embodiments, the antenna module (e.g., thesecond antenna module 1740 of FIG. 17) may include a first type antennaincluding a radiating surface directed toward a position between thesecond planar portion and the second curved portion.

An electronic device (e.g., the electronic device 101 of FIG. 1)according to various example embodiments may include a housing (e.g.,the housing 120 of FIG. 1), wherein the housing (e.g., the housing 120of FIG. 1) includes a first non-conductive plate (e.g., the first plate210 of FIG. 2), a second non-conductive plate (e.g., the second plate230 of FIG. 2), and a conductive lateral member comprising a conductivematerial (e.g., the conductive structure 220 of FIG. 2) surrounding aspace between the first non-conductive plate (e.g., the first plate 210of FIG. 2) and the second non-conductive plate (e.g., the second plate230 of FIG. 2), wherein the first non-conductive plate (e.g., the firstplate 210 in FIG. 2) includes a first planar portion, a first curvedportion, a second curved portion, and a third curved portion, whereinwhen viewed from above the first non-conductive plate (e.g., the firstplate 210 in FIG. 2), the first planar portion includes a first lateralportion extending in a first direction, a second lateral portionextending in a second direction perpendicular to the first direction, athird lateral portion extending in a third direction parallel to thesecond direction, and a fourth lateral portion extending in a fourthdirection parallel to the first direction, wherein the first curvedportion extends from the first lateral portion of the first planarportion, wherein the second curved portion extends from the secondlateral portion of the first planar portion, wherein the third curvedportion extends from the third lateral portion of the first planarportion, wherein the second non-conductive plate (e.g., the second plate230 in FIG. 2) includes a second planar portion, a fourth curvedportion, a fifth curved portion, and a sixth curved portion, whereinwhen viewed from above the second plate (e.g., the second plate 230 inFIG. 2), the second planar portion includes a fifth lateral portionparallel to the first lateral portion, a sixth lateral portion parallelto the second lateral portion, a seventh lateral portion parallel to thethird lateral portion, and an eighth lateral portion parallel to thefourth lateral portion, wherein the fourth curved portion extends fromthe fifth lateral portion of the second planar portion, wherein thefifth curved portion extends from the sixth lateral portion of thesecond planar portion, wherein the sixth curved portion extends from theseventh lateral portion of the second planar portion, wherein theconductive lateral member (e.g., the conductive structure 220 in FIG. 2)includes a first conductive portion disposed between the first curvedportion and the fourth curved portion; a second conductive portiondisposed between the second curved portion and the fifth curved portion;a third conductive portion disposed between the third curved portion andthe sixth curved portion; and a fourth conductive portion disposedbetween the fourth lateral portion and the eighth lateral portion, adisplay (e.g., the display 110 in FIG. 1) visible through the firstnon-conductive plate (e.g., the first plate 210 in FIG. 2), a firstantenna structure comprising at least one antenna (e.g., the firstantenna module 130 of FIG. 1) disposed in the space and adjacent to thefirst conductive portion of the conductive lateral member (e.g., theconductive structure 220 of FIG. 2), wherein the first antenna structure(e.g., the first antenna module 130 of FIG. 1) includes a first surfacedirected toward the second non-conductive plate (e.g., the second plate230 of FIG. 2), and at least one conductive plate directed toward thesecond non-conductive plate (e.g., the second plate 230 in FIG. 2), asecond antenna structure comprising at least one antenna (e.g., thesecond antenna module 140 of FIG. 1) disposed in the space and adjacentto the second conductive portion of the conductive lateral member (e.g.,the conductive structure 220 of FIG. 2), wherein the second antennastructure (e.g., the second antenna module 140 of FIG. 1) includes asecond surface directed toward the second conductive portion, and atleast one conductive plate directed toward the second conductiveportion, a third antenna structure comprising at least one antenna(e.g., the third antenna module 150 of FIG. 1) disposed in the space andadjacent to the third conductive portion of the conductive lateralmember (e.g., the conductive structure 220 of FIG. 2), wherein the thirdantenna structure (e.g., the third antenna module 150 in FIG. 1)includes a third surface directed toward the third conductive portion,and at least one conductive plate directed toward the third conductiveportion, and a wireless communication circuit electrically connected toat least one of the first antenna structure (e.g., the first antennamodule 130 of FIG. 1), the second antenna structure (e.g., the secondantenna module 140 of FIG. 1) or the third antenna structure (e.g., thethird antenna module 150 of FIG. 1), wherein the wireless communicationcircuit is configured to transmit and receive at least one signal with afrequency between 3 GHz and 100 GHz through at least one of the firstantenna structure (e.g., the first antenna module 130 of FIG. 1), thesecond antenna structure (e.g., the second antenna module 140 of FIG. 1)or the third antenna structure (e.g., the third antenna module 150 ofFIG. 1), wherein a first height H1 between the second planar portion andthe first conductive portion, a second height H2 between the secondplanar portion and the second conductive portion, a third height H3between the second planar portion and the third conductive portion, anda fourth height H4 between the second planar portion and the fourthconductive portion have a relationship: H2>H1>H4.

According to various example embodiments, the second height H2 may bethe equal to the third height H3.

According to various example embodiments, a fifth height H5 between thefirst planar portion and the first conductive portion, a sixth height H6between the first planar portion and the second conductive portion, aseventh height H7 between the first planar portion and the thirdconductive portion, and an eighth height H8 between the first planarportion and the fourth conductive portion may have a relationship:H5<H1, H6<H2, and H7<H3.

The electronic device according to various example embodiments disclosedin the disclosure may be various types of devices. The electronic devicemay include, for example, a portable communication device (e.g., asmartphone), a computer device, a portable multimedia device, a mobilemedical appliance, a camera, a wearable device, or a home appliance. Theelectronic device according to an embodiment of the disclosure shouldnot be limited to the above-mentioned devices.

It should be understood that various embodiments of the disclosure andterms used in the embodiments are not intended to limit technicalfeatures disclosed in the disclosure to a particular embodimentdisclosed herein; rather, the disclosure should be understood to covervarious modifications, equivalents, and/or alternatives of embodimentsof the disclosure. With regard to description of drawings, similar orrelated components may be assigned with similar reference numerals. Asused herein, singular forms of noun corresponding to an item may includeone or more items unless the context clearly indicates otherwise. In thedisclosure disclosed herein, each of the expressions “A or B”, “at leastone of A and B”, “at least one of A or B”, “A, B, or C”, “one or more ofA, B, and C”, or “one or more of A, B, or C”, and the like used hereinmay include any and all combinations of one or more of the associatedlisted items. The expressions, such as “a first”, “a second”, “thefirst”, or “the second”, may be used merely for the purpose ofdistinguishing a component from the other components, but do not limitthe corresponding components in other aspect (e.g., the importance orthe order). It is to be understood that if an element (e.g., a firstelement) is referred to, with or without the term “operatively” or“communicatively”, as “coupled with,” “coupled to,” “connected with,” or“connected to” another element (e.g., a second element), the element maybe coupled with the other element directly (e.g., wiredly), wirelessly,or via a third element.

The term “module” used in the disclosure may include a unit implementedin hardware, software, or firmware, or any combination thereof, and maybe interchangeably used with the terms “logic”, “logical block”, “part”and “circuit”. The “module” may be a minimum unit of an integrated partor may be a part thereof. The “module” may be a minimum unit forperforming one or more functions or a part thereof. For example,according to an embodiment, the “module” may include anapplication-specific integrated circuit (ASIC).

Various embodiments of the disclosure may be implemented by software(e.g., the program 2340) including an instruction stored in amachine-readable storage medium (e.g., an internal memory 2336 or anexternal memory 2338) readable by a machine (e.g., the electronic device2301). For example, the processor (e.g., the processor 2320) of amachine (e.g., the electronic device 2301) may call the instruction fromthe machine-readable storage medium and execute the instructions thuscalled. This means that the machine may perform at least one functionbased on the called at least one instruction. The one or moreinstructions may include a code generated by a compiler or a codeexecutable by an interpreter. The machine-readable storage medium may beprovided in the form of non-transitory storage medium. Here, the“non-transitory storage medium is tangible, but may not include a signal(e.g., an electromagnetic wave). The term “non-transitory” does notdifferentiate a case where the data is permanently stored in the storagemedium from a case where the data is temporally stored in the storagemedium.

According to an embodiment, a method according to various embodimentsdisclosed in the disclosure may be provided as a part of a computerprogram product. The computer program product may be traded between aseller and a buyer as a product. The computer program product may bedistributed in the form of machine-readable storage medium (e.g., acompact disc read only memory (CD-ROM)) or may be directly distributed(e.g., download or upload) online through an application store (e.g., aPlay Store™) or between two user devices (e.g., the smartphones). In thecase of online distribution, at least a portion of the computer programproduct may be temporarily stored or generated in a machine-readablestorage medium such as a memory of a manufacturer's server, anapplication store's server, or a relay server.

According to various example embodiments, each component (e.g., themodule or the program) of the above-described components may include oneor plural entities. According to various embodiments, at least one ormore components of the above components or operations may be omitted, orone or more components or operations may be added. Alternatively oradditionally, some components (e.g., the module or the program) may beintegrated in one component. In this case, the integrated component mayperform the same or similar functions performed by each correspondingcomponents prior to the integration. According to various embodiments,operations performed by a module, a programming, or other components maybe executed sequentially, in parallel, repeatedly, or in a heuristicmethod, or at least some operations may be executed in differentsequences, omitted, or other operations may be added.

The electronic device according to various example embodiments disclosedin the disclosure may have the antenna for 4G communication and antennafor 5G communication mounted therein. In this connection, the 5Gcommunication antenna may be disposed on each of a top surface and leftand right lateral surfaces of the device to output a signal in a mmWavefrequency band in various directions.

The electronic device according to various example embodiments disclosedin the disclosure may improve transmission and reception performance ofthe mmWave signal by variously changing the placement mode of theantenna for 5G communication.

The electronic device according to various example embodiments disclosedin the disclosure may include the light-emission element that emitslight based on the operation state of the antenna for 5G communication.

While the disclosure has been illustrated and described with referenceto various example embodiments thereof, it will be understood by thoseskilled in the art that various changes in form and details may be madetherein without departing from the spirit and scope of the disclosure,including the appended claims and their equivalents.

What is claimed is:
 1. An electronic device comprising: a firstnon-conductive cover defining at least a portion of a first surface ofthe electronic device; a second non-conductive cover including a firstportion defining at least a portion of a second surface of theelectronic device opposite the first surface, and a second portionextending from an edge of the first portion and defining one portion ofa first lateral surface of the electronic device between the firstsurface and the second surface; a conductive frame defining anotherportion of the first lateral surface of the electronic device; and afirst antenna module including one surface defining a radiator, whereinthe first antenna module is positioned so that the one surface issubstantially perpendicular to the second surface at a position within aspecified proximity to the first lateral surface of the electronicdevice and is configured to transmit and/or receive a signal through thefirst lateral surface, wherein the second non-conductive cover comprisesglass, wherein at least a half of the one surface of the first antennamodule is directed toward the second portion of the secondnon-conductive cover.
 2. The electronic device of claim 1, furthercomprising: a display, wherein the first non-conductive cover is a glasscover covering the display, and wherein the second non-conductive coveris a back cover.
 3. The electronic device of claim 1, furthercomprising: a display, wherein the second non-conductive cover is aglass cover covering the display, and wherein the first non-conductivecover is a back cover.
 4. The electronic device of claim 1, wherein thesecond non-conductive cover includes an inorganic oxide, and wherein theinorganic oxide includes at least one of glass, ceramic or sapphire. 5.The electronic device of claim 1, wherein the first antenna moduleincludes a non-conductive member comprising non-conductive materialdisposed between the second portion and the one surface of the firstantenna module.
 6. The electronic device of claim 5, wherein an air gapis defined between the non-conductive member, the second portion and theone surface.
 7. The electronic device of claim 1, wherein the firstantenna module includes a first type antenna having a radiating surfacedirected toward a position between the first portion and the secondportion.
 8. The electronic device of claim 1, wherein the one surface ofthe first antenna module partially overlaps the conductive frame.
 9. Theelectronic device of claim 1, wherein the first portion includes aplanar portion, and wherein the second portion includes a curved portionextending from an edge of the planar portion.
 10. The electronic deviceof claim 1, wherein the first antenna module is configured to transmitand/or receive the signal having a frequency between 6 GHz and 100 GHz.11. The electronic device of claim 1, further comprising a secondantenna module; wherein the second antenna module includes: a first typeantenna including a first radiating surface directed toward the secondsurface; and a second type antenna including a second radiating surfacedirected toward a second lateral surface of the electronic device. 12.The electronic device of claim 11, wherein at least a portion of thesecond radiating surface is positioned to be directed toward a portionof the second non-conductive cover extending to the second lateralsurface when viewed from the second lateral surface.
 13. The electronicdevice of claim 11, wherein the conductive frame includes an opening inthe first lateral surface configured to expose a physical button,wherein the second radiating surface is provided in a first direction ofthe opening, and wherein a third radiating surface of the first antennamodule is provided in a second direction of the opening.
 14. Theelectronic device of claim 11, wherein each of the first antenna moduleand the second antenna module is configured to transmit or receive asignal having a mmWave frequency band as a first frequency band.
 15. Theelectronic device of claim 11, wherein at least a portion of theconductive frame is configured to act as an antenna radiator configuredto transmit and receive a signal of a second frequency band.
 16. Theelectronic device of claim 11, wherein a height of a portion of thesecond non-conductive cover extending along the second lateral surfaceis less than a height of a portion of the second non-conductive coverextending along the first lateral surface.
 17. The electronic device ofclaim 16, wherein the height of the portion of the second non-conductivecover extending along the second lateral surface is less than a heightof the conductive frame defining the second lateral surface.
 18. Theelectronic device of claim 16, wherein a height of a portion of thefirst non-conductive cover extending along the second lateral surface isless than a height of the conductive frame defining the second lateralsurface or the height of the portion of the second non-conductive coverextending along the second lateral surface.
 19. The electronic device ofclaim 16, wherein a height of a portion of the second non-conductivecover extending along the first lateral surface is greater than theheight of a portion of the first non-conductive cover extending alongthe second lateral surface.
 20. The electronic device of claim 16,wherein the height of the portion of the second non-conductive coverextending along the first lateral surface is greater than a height ofthe conductive frame defining the first lateral surface.